PMEG4010ET,215

PMEG4010EH_EJ_ET_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 21 March 2007 6 of 11
NXP Semiconductors
PMEG4010EH/EJ/ET
1 A very low V
F
MEGA Schottky barrier rectifiers
8. Test information
9. Package outline
Fig 4. Duty cycle definition
t
1
t
2
P
t
006aaa812
duty cycle δ =
t
1
t
2
Fig 5. Package outline SOD123F Fig 6. Package outline SOD323F (SC-90)
Fig 7. Package outline SOT23 (TO-236AB)
04-11-29Dimensions in mm
1.2
1.0
0.25
0.10
3.6
3.4
2.7
2.5
0.55
0.35
0.70
0.55
1.7
1.5
1
2
04-09-13Dimensions in mm
0.80
0.65
0.25
0.10
0.5
0.3
2.7
2.3
1.8
1.6
0.40
0.25
1.35
1.15
1
2
04-11-04Dimensions in mm
0.45
0.15
1.9
1.1
0.9
3.0
2.8
2.5
2.1
1.4
1.2
0.48
0.38
0.15
0.09
12
3
PMEG4010EH_EJ_ET_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 21 March 2007 7 of 11
NXP Semiconductors
PMEG4010EH/EJ/ET
1 A very low V
F
MEGA Schottky barrier rectifiers
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
11. Soldering
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000 10000
PMEG4010EH SOD123F 4 mm pitch, 8 mm tape and reel -115 -135
PMEG4010EJ SOD323F 4 mm pitch, 8 mm tape and reel -115 -135
PMEG4010ET SOT23 4 mm pitch, 8 mm tape and reel -215 -235
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 8. Reflow soldering footprint SOD123F
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 9. Reflow soldering footprint SOD323F (SC-90)
1.6
1.6
2.9
4
4.4
1.1 1.22.1
1.1
(2×)
solder lands
solder resist
occupied area
solder paste
msa433
1.65
0.50
(2×)
2.10
1.60
2.80
0.60
3.05
0.500.95
solder lands
solder resist
occupied area
solder paste
PMEG4010EH_EJ_ET_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 21 March 2007 8 of 11
NXP Semiconductors
PMEG4010EH/EJ/ET
1 A very low V
F
MEGA Schottky barrier rectifiers
Fig 10. Reflow soldering footprint SOT23 (TO-236AB)
Fig 11. Wave soldering footprint SOT23 (TO-236AB)
solder resist
occupied area
solder lands
solder paste
Dimensions in mm
sot023
1.00
0.60
(3x)
1.30
12
3
2.50
3.00
0.85
2.70
2.90
0.50 (3x)
0.60 (3x)
3.30
0.85
sot023
4.004.60
2.80
4.50
1.20
3.40
3
21
1.20 (2x)
preferred transport direction during soldering
Dimensions in mm
solder resist
occupied area
solder lands

PMEG4010ET,215

Mfr. #:
Manufacturer:
Nexperia
Description:
Schottky Diodes & Rectifiers SCHOTTKY 40V 1A
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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