MAX1595
Regulated 3.3V/5.0V Step-Up/
Step-Down Charge Pump
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
IN
= 2V for MAX1595_ _ _33, V
IN
= 3V for MAX1595_ _ _50, C
IN
= 1µF, C
X
= 0.22µF, C
OUT
= 1µF, T
A
= -40° to +85°C, unless otherwise
noted. Typical values are at T
A
= +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
IN, OUT, AOUT to GND............................................-0.3V to +6V
SHDN to PGND ........................................................-0.3V to +6V
PGND to GND .......................................................-0.3V to +0.3V
CXN to PGND.....................-0.3V to (Lower of IN + 0.8V or 6.3V)
CXP to GND ................................-0.8V to (Higher of OUT + 0.8V
or IN + 0.8V but not greater than 6V)
Continuous Output Current ...............................................150mA
Continuous Power Dissipation (T
A
= +70°C)
µMAX (derate 4.8mW/°C above +70°C) ..................387.8mW
TQFN-EP (derate 24.4mW/°C above +70°C).........1951.2mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Input Voltage Range V
IN
1.8 5.5 V
Input Undervoltage Lockout
Threshold
1.40 1.60 1.72 V
Input Undervoltage Lockout
Hysteresis
40 mV
T
A
= 0°C to +85°C 4.85 5.05 5.15
0 < I
L OA D
< 125m A,
V
I N
= + 3.0V
T
A
= -40°C to +85°C 4.80 5.20
T
A
= 0°C to +85°C 3.20 3.33 3.40
0 < I
LOAD
< 75mA, V
IN
= +2.0V
T
A
= -40°C to +85°C 3.16 3.44
T
A
= 0°C to +85°C 3.20 3.33 3.40
Output Voltage V
OUT
0 < I
LOAD
< 30mA, V
IN
= +1.8V
T
A
= -40°C to +85°C 3.16 3.44
V
V
IN
= +2.0V, MAX1595_ _ _33 220 320
No-Load Input Current I
Q
V
IN
= +3.0V, MAX1595_ _ _50 240 350
µA
Switching Frequency f
OSC
I
L OA D
> 20m A, V
OU T
> V
IN
0.85 1.0 1.15 MHz
Shutdown Supply Current I
SHDN
V
SHDN
= 0V, V
IN
= +5.5V, V
OUT
= 0V 5 µA
SHDN Input Voltage Low V
IN L
V
IN
= 2.0V to 5.5V 0.6 V
SHDN Input Voltage High V
IN H
V
IN
= 2.0V to 5.5V 1.6 V
SHDN Input Leakage Current 0.1 µA
Note 2: Specifications to -40°C are guaranteed by design, not production tested.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (θ
JA
)..........41°C/W
Junction-to-Case Thermal Resistance (θ
JC
).................6°C/W
µMAX
Junction-to-Ambient Thermal Resistance (θ
JA
).....206.3°C/W
Junction-to-Case Thermal Resistance (θ
JC
)...............42°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.
