AOTF12N30

AOT12N30/AOTF12N30
300V,11.5A N-Channel MOSFET
General Description Product Summary
V
DS
I
D
(at V
GS
=10V) 11.5A
R
DS(ON)
(at V
GS
=10V) < 0.42
100% UIS Tested
100% R
g
Tested
For Halogen Free add "L" suffix to part number:
AOT12N30L/AOTF12N30L
Symbol
Parameter
Absolute Maximum Ratings T
A
=25°C unless otherwise noted
350V@150
The AOT12N30/AOTF12N30 is fabricated using an
advanced high voltage MOSFET process that is designed
to deliver high levels of performance and robustness in
popular AC-DC applications.By providing low R
DS(on)
, C
iss
and C
rss
along with guaranteed avalanche capability this
parts can be adopted quickly into new and existing offline
power supply designs.These parts are ideal for boost
converters and synchronous rectifiers for consumer,
telecom, industrial power supplies and LED backlighting.
Units
AOT12N30
AOTF12N30
G
D
S
AOTF12N30
Top View
TO-220FTO-220
AOT12N30
G
D
G
D
Symbol
V
DS
V
GS
I
DM
I
AS
E
AS
Peak diode recovery dv/dt dv/dt
T
J
, T
STG
T
L
Symbol
R
θ
JA
R
θCS
R
θJC
P
D
°C/W
°C
Maximum Junction-to-Ambient
A,D
°C/W
300
Thermal Characteristics
AOTF12N30
65
0.5
AOT12N30
36
0.3
V
Parameter
Drain-Source Voltage 300
Units
AOT12N30
AOTF12N30
V±30Gate-Source Voltage
Continuous Drain
Current
T
C
=25°C
I
D
A
29Pulsed Drain Current
C
T
C
=100°C
11.5
7.3
11.5*
7.3*
Maximum Junction-to-Case
Avalanche Current
C
Single pulsed avalanche energy
G
430
Parameter
Maximum Case-to-sink
A
Maximum lead temperature for soldering
purpose, 1/8" from case for 5 seconds
Junction and Storage Temperature Range
Derate above 25
o
C
T
C
=25°C
3.8
5
Power Dissipation
B
-55 to 150
132
1
V/ns
Units
A
°C
mJ
W
W/
o
C
0.95
65
--
3.5 °C/W
Rev 1: Nov 2011
www.aosmd.com Page 1 of 6
AOT12N30/AOTF12N30
Symbol Min Typ Max Units
300
350
BV
DSS
/∆TJ
0.29
V/
o
C
1
10
I
GSS
Gate-Body leakage current
±100
nΑ
V
GS(th)
Gate Threshold Voltage
3.4 4 4.5 V
R
DS(ON)
0.31 0.42
g
FS
11 S
V
SD
0.74 1 V
I
S
Maximum Body-Diode Continuous Current 11.5 A
I
SM
29 A
C
iss
500 632 790 pF
C
oss
55 90 125 pF
C
rss
3 7 11 pF
R
g
1.3 2.7 4.1
Q
g
10 12.8 16 nC
Q
gs
4.4 nC
Q
gd
4.3 nC
t
D(on)
18 ns
t
r
31 ns
t
D(off)
36
ns
Electrical Characteristics (T
J
=25°C unless otherwise noted)
STATIC PARAMETERS
Parameter Conditions
Static Drain-Source On-Resistance
V
GS
=10V, I
D
=6A
Reverse Transfer Capacitance
V
GS
=0V, V
DS
=25V, f=1MHz
I
DSS
Zero Gate Voltage Drain Current
V
DS
=300V, V
GS
=0V
Diode Forward Voltage
V
DS
=5V
I
D
=250µA
V
DS
=240V, T
J
=125°C
Turn-Off DelayTime
V
GS
=10V, V
DS
=150V, I
D
=12A,
R
G
=25
Gate resistance
V
GS
=0V, V
DS
=0V, f=1MHz
Total Gate Charge
V
GS
=10V, V
DS
=240V, I
D
=12A
Gate Source Charge
Gate Drain Charge
SWITCHING PARAMETERS
I
S
=1A,V
GS
=0V
V
DS
=40V, I
D
=6A
Forward Transconductance
Zero Gate Voltage Drain Current
ID=250µA, V
GS
=0V
BV
DSS
Maximum Body-Diode Pulsed Current
Input Capacitance
Output Capacitance
Turn-On DelayTime
DYNAMIC PARAMETERS
Turn-On Rise Time
µA
V
DS
=0V, V
GS
=±30V
V
Drain-Source Breakdown Voltage
I
D
=250µA, V
GS
=0V, T
J
=25°C
I
D
=250µA, V
GS
=0V, T
J
=150°C
t
D(off)
36
ns
t
f
20 ns
t
rr
130 170 205 ns
Q
rr
1 1.3 1.6
µC
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Body Diode Reverse Recovery Time
I
F
=12A,dI/dt=100A/µs,V
DS
=100V
Turn-Off DelayTime
R
G
=25
Turn-Off Fall Time
Body Diode Reverse Recovery Charge
I
F
=12A,dI/dt=100A/µs,V
DS
=100V
A. The value of R
θJA
is measured with the device in a still air environment with T
A
=25°C.
B. The power dissipation P
D
is based on T
J(MAX)
=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature T
J(MAX)
=150°C, Ratings are based on low frequency and duty cycles to keep initial
T
J
=25°C.
D. The R
θJA
is the sum of the thermal impedance from junction to case R
θJC
and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of T
J(MAX)
=150°C. The SOA curve provides a single pulse rating.
G. L=60mH, I
AS
=3.8A, V
DD
=150V, R
G
=25, Starting T
J
=25°C
Rev 1: Nov 2011 www.aosmd.com Page 2 of 6
AOT12N30/AOTF12N30
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
0
4
8
12
16
20
0 5 10 15 20 25 30
I
D
(A)
V
DS
(Volts)
Fig 1: On-Region Characteristics
V
GS
=5.5V
6V
10V
6.5V
0.1
1
10
100
0 2 4 6 8 10
I
D
(A)
V
GS
(Volts)
Figure 2: Transfer Characteristics
-
55
°
C
V
DS
=40V
25°C
125
°
C
0.0
0.3
0.6
0.9
1.2
1.5
0 5 10 15 20 25
R
DS(ON)
(
)
I
D
(A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage
V
GS
=10V
0
0.5
1
1.5
2
2.5
3
-100 -50 0 50 100 150 200
Normalized On-Resistance
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
V
GS
=10V
I
D
=6A
40
1.0E-04
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
0.0 0.2 0.4 0.6 0.8 1.0
I
S
(A)
V
SD
(Volts)
Figure 6: Body-Diode Characteristics (Note E)
25°C
125°C
Voltage
0.8
0.9
1
1.1
1.2
-100 -50 0 50 100 150 200
BV
DSS
(Normalized)
T
J
(
°
C)
Figure 5:Break Down vs. Junction Temperature
Rev 1: Nov 2011 www.aosmd.com Page 3 of 6

AOTF12N30

Mfr. #:
Manufacturer:
Description:
MOSFET N-CH 300V 11.5A TO220F
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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