LT3760
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users can log onto www.murata.com/designlib and down-
load the software followed by instructions for creating an
output voltageV
OUT
’ (LT3760 CTRL pin voltage) from a
specified V
CC
supply (LT3760 V
REF
pin voltage). At any
time during selection of circuit parameters the user can
access data on the chosen NTC resistor by clicking on
the link to the Murata catalog. For a detailed example of
hand calculations using an NTC type resistor divider to
program CTRL pin voltage, read the LT3478 LED driver
data sheet section Programming LED Current Derating vs
Temperature under Applications Information.
Using the T
SET
Pin for Thermal Protection
The LT3760 contains a special programmable thermal
regulation loop that limits the internal junction temperature
of the part. Since the LT3760 topology consists of a single
boost controller with eight linear current sources, any LED
string voltage mismatch will cause additional power to be
dissipated in the package. This topology provides excellent
current matching between LED strings and allows a single
power stage to drive a large number of LEDs, but at the
price of additional power dissipation inside the part (which
means a higher junction temperature). Being able to
limit
the
maximum junction temperature allows the benefits of
this topology to be fully realized. This thermal regulation
feature provides important protection at high ambient tem-
peratures, and allows a given application to be optimized
for typical, not worst-case, ambient temperatures with
the assurance that the LT3760 will automatically protect
itself and the LED strings under worst-case conditions.
The operation of the thermal loop is simple. As the ambi-
ent temperature increases, so does the internal junction
temperature of the part. Once the programmed maximum
junction temperature is reached, the LT3760 begins to
linearly reduce the LED current, as needed, to try and
maintain this temperature. This can only be achieved
when the ambient temperature stays below the desired
maximum junction temperature. If the ambient tempera-
ture continues to rise past the programmed maximum
junction temperature, the LEDs current will be reduced
to approximately 5% of the full LED current.
While this feature is intended to directly protect the LT3760,
it can also be used to derate the LED current at high tem-
peratures. Since there is a direct relationship between the
LED temperature and LT3760 junction temperature, the
TSET function also provides some LED current derating
at high temperatures.
Tw o
external resistors program the maximum IC junction
temperature using a resistor divider from the V
REF
pin,
as shown in Figure 9. Choose the ratio of R1 and R2 for
the desired junction temperature. Figure 10 shows the
relationship of T
SET
voltage to junction temperature, and
Table 8 shows commonly used values for R1 and R2.
Figure 9. Programming the T
SET
Pin
3760 F09
LT3760
V
REF
T
SET
R2
R1
3
2
Figure 10. Programing the T
SET
Pin Threshold
JUNCTION TEMPERATURE (°C)
0
500
V
TSET
THRESHOLD (mV)
600
700
800
50
100 125
25
75
150
950
550
650
750
850
900
3760 F10
V
PTAT
Table 8. Resistor Values to Program Maximum IC Junction
Temperature (V
REF
(Typical) = 1.485V)
T
J
(°C) R1 (kΩ) R2 (kΩ) T
SET
(V)
100 24.9 20 0.824
115 28.0 20 0.866
130 30.9 20 0.902
LT3760
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Programming Overvoltage Protection (OVP) Level
The LT3760 LED driver provides optimum protection to
the LEDs and the external MOSFET by providing a pro-
grammable maximum regulated output voltage limit using
the OVP
SET
pin. The Overvoltage Protection (OVP) level
is programmed as:
OVP(MAXIMUM REGULATED V
OUT
) = 57 • OVP
SET
If every LED string fails open or the multiple string LED
display becomes disconnected the LT3760 LED driver loop
regulates to the programmed OVP level. The OVP level
should be programmed to a level high enough to regulate
the LED strings but low enough to prevent damage to the
power switch and to minimize the voltage across the LED
pins upon reconnection of the LED strings. Recommended
OVP level is given by:
OVP(RECOMMENDED) = 1.2 • ((NV
F
) + 1V)
where:
N = number of LEDs in each string,
V
F
= maximum LED forward voltage drop
and the scaling factor of 1.2 accounts for variation in the
generation of OVP from OVP
SET
pin voltage and startup
logic requirements.
Example: For a converter operating with 10 LEDs per string
at a maximum forward voltage of 4V per LED, the OVP
level should be programmed to:
OVP(RECOMMENDED) = 1.2 (10 4)+ 1V
( )
= 49.2V
For OVP = 49.2V, OVP
SET
=
49.2
57
= 0.863V
The OVP
SET
pin voltage can be generated using a resistor
divider from the REF pin.
LED Open Circuit and PWM Dimming Ratios
The LT3760 monitors each LED pin voltage to determine if
the LED string has an open fault (LED pin voltage < 0.5V).
If an open LED fault occurs, the FAULT flag is pulled low.
To avoid false detection of faults during the initial converter
startup when V
OUT
is low, the LT3760 ignores low LED
pin voltages until V
OUT
reaches 90% of its maximum al-
lowed OVP level. Once this condition is met, the LT3760
monitors all LED pins for open LED faults. To avoid false
detection of faults during PWM dimming edges (where
LED pins can possibly ring and trip fault detection levels)
the LT3760 only monitors/updates fault conditions during
PWM high (and only after a blank duration ofs following
each PWM rising edge).
LED Short Circuit
A short circuit fault between the positive terminal of an
LED string (V
OUT
) and the negative terminal of the LED
string (LEDx pin) causes the channel to be disabled in
order to protect the internal current source. A resistive
short is allowed as long
as (V
OUT
-V
LEDx
) < 6V.
Loop Compensation
Be sure to check the stability of the loop with the LEDs
connected (LED regulation loop) and disconnected
(Overvoltage Protection (OVP) regulation loop). Various
application circuits are shown in the data sheet which
cover a range of V
IN
, V
OUT
, f
OSC
, output power and inductor
current ripple values. For application requirements which
deviate from the circuits shown in the data sheet be sure
to check the stability of the final application over the full
V
IN
range, LED current range (if analog dimming) and
temperature range. Be aware that if the V
C
pin components
represent a dominant pole for the converter loop and they
have been adjusted to achieve stability, the V
C
pin might
move more slowly during load transient conditions such
as an all-LEDs-open fault. A slower moving V
C
pin will
add to V
OUT
overshoot during an all-LEDs-open fault.
An alternative compensation approach is to place the
dominant pole of the converter loop at the output. This
requires an increased output capacitor value but will allow
a much reduced Vc capacitor. The combination will allow
V
C
to move more quickly and V
OUT
to move more slowly
resulting in less overshoot during an all-LEDs-open fault.
LT3760
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Thermal Considerations
The internal power dissipation of the LT3760 comes from 3
main sources: V
IN
quiescent current (I
Q
total), V
IN
current
for GATE switching (I
GATE
) and the LT3760 LED current
sources. Since the maximum operational V
IN
voltage is
40V, care should be taken when selecting the switching
frequency and type of external power MOSFET since the
current required from V
IN
for GATE switching is given by,
I
GATE
= f
OSC
Qg
where Q
g
is the gate charge (at V
GS
= INTV
CC
) specified
for the MOSFET and f
OSC
is the programmed switching
frequency for the LT3760. A low Q
g
MOSFET should al-
ways be used when operating the LT3760 from high V
IN
voltages. The internal junction temperature of the LT3760
can be estimated as:
T
J
= T
A
+ [V
IN
( I
QTOTAL
+ (f
OSC
Q
g
)) + (8 I(LED
X
) 1.1V)]
θ
JA
where, T
A
is the ambient temperature for the LT3760
I
QTOTAL
represents the V
IN
quiescent current for the LT3760
(not switching, PWM = 1.5V and CTRL = 0.1V) - illustrated
in the Typical Characteristics Graphsplus the base cur-
rents of active channels (typically 8 I(LED)/75). θ
JA
is
the thermal resistance of the package (28°C/W for the
28-pin TSSOP package).
Example
: For a 12W LED driver application requiring 8
strings of 10 LEDs each driven with 40mA, V
IN
= 24V, f
OSC
= 1MHz, Q
g
(at 7V V
GS
) = 15nC, I(LED
X
) = 40mA, and an
85°C ambient temperature for the LT3760 IC, the LT3760
junction temperature can be approximated as:
T
J
= 85°C + [24 (9.5mA + (8 40mA/75) + (1MHz
• 15nC)) + (8 • 40mA • 1.1V)] • 34
= 85°C + [(24 • 28.8mA) + (320mA • 1.1V)] • 34
= 85°C + (0.691W + 0.35W) • 34
= 85°C + 35°C
T
J
= 120°C
The exposed pad on the bottom of the package must be
soldered to the ground plane. The ground plane should
be connected to an internal copper ground plane with vias
placed directly under the package to spread out the heat
generated by the LT3760.
Circuit Layout Considerations
As with all switching regulators, careful attention must
be given to PCB layout and component placement to
achieve optimal thermal, electrical and noise performance.
The exposed pad of the LT3760 should be soldered to a
continuous copper ground plane underneath the device
to reduce die temperature and maximize the power capa-
bility of the IC. The signal ground (GND, pin 24) is down
bonded to the exposed pad near the
RT and V
C
pins.
I
SET
, R
T
and V
C
components should be connected to an
area of ground copper connected to pin 24. The OVP
SET
track should be kept away from fast moving signals and
not loaded with an external capacitor. GATE pin turn off
currents escape through a downbond to the exposed pad
and exit the PGND, pin 10. This area of copper and pin
10 should be the power ground (PGND) connection for
the inductor input capacitor, INTV
CC
capacitor and output
capacitor. A separate bypass capacitor for the V
IN
pin of
the IC may be required close the V
IN
pin and connected to
the copper area associated with signal ground, pin 24. To
minimize MOSFET peak current sensing errors the sense
resistor (RS) should have Kelvin connections to the SENSE
pin and the power ground copper area near the pin. The
MOSFET drain rise and fall times are designed to be as
short as possible for maximum efficiency. To reduce the
effects of both radiated and conducted noise, the area of
the copper trace for the MOSFET drain should be kept as
small as possible. Use a ground plane under the switching
regulator to minimize interplane coupling. The Schottky
diode
and output capacitor should be placed as close as
possible to the drain node to minimize this high switching
frequency path.

LT3760EFE#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
LED Lighting Drivers 8 Channel 100mA LED Driver with 60V boost conveter
Lifecycle:
New from this manufacturer.
Delivery:
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