TCK22892G,LF

TCK22xxxG/TCK2065G/TCK1024G
2016-02-12
7
Application Note
1. Application circuit example (top view)
The figure below shows the recommended configuration.
1) Input and Output capacitor
An input capacitor (C
IN
) and an output capacitor (C
OUT
) are necessary for the stable operation. And it is
effective to reduce voltage overshoot or undershoot due to sharp changes in output current and also for improved
stability of the power supply. When used, place C
IN
and C
OUT
more than 1.0μF as close to V
IN
pin to improve
stability of the power supply.
2) Control pin
The CONTROL pin controls state of the switch, operated by the control voltage and Schmitt trigger. Also, pull
down resistance equivalent to a few MΩ is connected between CONTROL and GND, thus the load switch IC is in
OFF state even when CONTROL pin is OPEN.
2. Over current limit function
This device has a built-in fold-back type of Current-limiting Circuit. Around 15% or more derating against typical
values is recommended for system design with enough margin.
3. Thermal shutdown function
This device has a built-in Thermal shutdown circuit. If the junction temperature goes beyond 170°C (Typ.),
thermal shutdown circuit operates and turns off power switch. When the junction temperature decreases lower than
150°C, the power switch is turned on due to hysteresis. This operation is repeated as long as the junction
temperature continues increasing.
4. True reverse current blocking function(Option)
This device has built-in True reverse current blocking circuit (TRCB) to block reverse current from VOUT to VIN
regardless of output MOSFET ON/OFF condition. (Full-Time Reverse Current Protection)
5. Under-voltage Lockout function(Option)
This device has a built-in Under-voltage Lockout Circuit to turn off switch if VIN drops below UVLO. This circuit
has hysteresis and UVLO is released when VIN exceeds threshold.
6. Instructions and directions for use
This device has a built-in several functions, but these does not assure for the suppression of uprising device
operation. In use of these products, please read through and understand dissipation idea for absolute maximum
ratings from the above mention or our Semiconductor Reliability Handbook. Then use these products under
absolute maximum ratings in any condition. Furthermore, Toshiba recommend inserting failsafe system into the
design.
Control
Voltage
Output
Voltage
HIGH
ON
LOW
OFF
OPEN
OFF
V
OUT
GND
V
IN
CONTROL
C
L
R
L
LOAD
C
IN
C
OUT
TCK22xxxG/TCK2065G/TCK1024G
2016-02-12
8
7.
Power Dissipation
Power dissipation is measured on the board condition shown below.
[The Board Condition]
Board material: Glass epoxy (FR4)
Board dimension: 40mm x 40mm (both sides of board), t=1.6mm
Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50%
Through hole: diameter 0.5mm x 28
Please allow sufficient margin when designing a board pattern to fit the expected power dissipation. Also take into
consideration the ambient temperature, input voltage, output current etc and applying the appropriate derating for
allowable power dissipation during operation.
0
200
400
600
800
1000
-40 0
40
80 120
Power Dissipation P
D
(mW)
Ambient Temperature Ta (℃)
P
D
- Ta
TCK22xxxG/TCK2065G/TCK1024G
2016-02-12
9
Package dimension
Weight: 1 mg (typ.)
Unit: mm

TCK22892G,LF

Mfr. #:
Manufacturer:
Toshiba
Description:
Power Switch ICs - Power Distribution Load Switch 0.74A 1.4V to 5.5V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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