2
Technical Data 10476
Effective November 2015
FP1108B
High frequency, high current power inductors
www.eaton.com/elx
Product specifications
Part Number
8
OCL
1
(nH)±10%
FLL
2
(nH) minimum
I
rms
3
(amps)
I
sat
1
4
(amps)
I
sat
2
5
(amps)
I
sat
3
6
(amps)
DCR (mΩ)
±5% @ 20°C K-factor
7
B1 version
FP1108B1-R180-R 180 130 40 63 55 50 0.29 349
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, +25°C
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, I
sat
1, +25°C
3. I
rms
: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary
for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generat-
ing components will affect the temperature rise. It is recommended that the temperature of the part
not exceed 125°C under worst case operating conditions verified in the end application.
4. I
sat
1: Peak current for approximately 20% rolloff @ +25°C
5. I
sat
2: Peak current for approximately 20% rolloff @ +85°C
6. I
sat
2: Peak current for approximately 20% rolloff @ +125°C
7. K-factor: Used to determine B
p-p
for core loss (see graph).
B
p-p
= K * L * ∆I * 10
-3
. B
p-p
:(Gauss), K: (K-factor from table),
L: (Inductance in nH), ∆I (Peak-to-peak ripple current in Amps).
8. Part Number Definition: FP1108Bx-Rxxx-R
FP1108B= Product code and size
x= Version indicator
Rxxx= Inductance value in μH, R= decimal point
-R suffix = RoHS compliant
Dimensions (mm)
Part marking: FP1108Bx (Product code and size, x = version indicator),
Rxxx = Inductance value in uH, R = decimal point
wwllyy = date code, R = revision level
All soldering surface to be coplanar within 0.10mm
DCR measured between point “a” and point “b”
Recommended Pad Layout Schematic
