BGA 700L16 E6327 Datasheet BGA 700L16 E6327 | P1-P2

T H E B G A 7 0 0 L 1 6 is a Wireless LAN dual band Low Noise Ampliﬁer.

The ampliﬁer comprises a single stage ampliﬁer for the 2.45 GHz band and a two-

stage ampliﬁer to meet the requirements of the 4.9 to 5.95 GHz band. The complete

circuitry, including a temperature stabilization block, ﬁts on one die and needs no

external matching elements.

One of the challenges of Wireless LAN application designers is to maximize network

coverage and data throughput. The receiver system noise ﬁgure determines

sensitivity, network coverage and data throughput.

The BGA700L16 uses a combination of Silicon Germanium Carbon epitaxy

proprietary process and a low ohmic on chip ground contact from Inﬁneon

Technologies to deliver the word best-in class noise ﬁgure for wireless LAN systems.

The BGA700L16 ships as bare die or in a low proﬁle Tiny Small Leadless Package

code-named TSLP-16. The package dimensions are 2.3 x 2.3 x 0.39 mm

w w w . i n f i n e o n . co m / s m a l l s i g n a l d i s c r e t e s

Applications

802.11a/b/g/n

Features

Input/output 50 W matched internally

SiGe:C process

Shut down mode

Temperature stabilization

Beneﬁts

Extended coverage

Ultra-low noise ﬁgure

Small form factor

High level of integration

Low cost

TSLP-16 Package

2.3 x 2.3 x 0.39 mm

■

Small Signal Discretes

Product Brief

BGA700L16

Low Noise Amplifier for IEEE 802.11a/b/g/n

Product Brief

How to reach us:

http://www.inﬁneon.com

Published by

Inﬁneon Technologies AG

81726 Munich, Germany

Legal Disclaimer

The information given in this Product Brief shall in no event be

regarded as a guarantee of conditions or characteristics

(“Beschaffenheitsgarantie”). With respect to any examples or hints

given herein, any typical values stated herein and/or any informa-

tion regarding the application of the device, Inﬁneon Technologies

hereby disclaims any and all warranties and liabilities of any kind,

including without limitation warranties of non-infringement of

intellectual property rights of any third party.

Information

For further information on technology, delivery terms and

conditions and prices please contact your nearest

Inﬁneon Technologies Ofﬁce (www.inﬁneon.com).

Warnings

Due to technical requirements components may contain

dangerous substances. For information on the types in question

please contact your nearest Inﬁneon Technologies Ofﬁce.

Inﬁneon Technologies Components may only be used in life-

support devices or systems with the express written approval

of Inﬁneon Technologies, if a failure of such components can

reasonably be expected to cause the failure of that life-support

device or system, or to affect the safety or effectiveness of that

device or system.

Life support devices or systems are intended to be implanted in

the human body, or to support and/or maintain and sustain

and/or protect human life. If they fail, it is reasonable to assume

that the health of the user or other persons may be endangered.

Published by Inﬁneon Technologies AG

Application Circuit

Bandgap Reference and

Biasing Circuit

CC1

Backside_GND

LNA_ON_52

CC2

LNA_ON_24

RF_IN_24

RF_IN_52

RF_OUT_52

RF_OUT_24

1615

7 0

1 µF

Performance

Band [GHz] Supply Voltage [V] Supply Current [mA] Gain [dB] Noise Figure [dB] Input P1dB [dB]

2.4 2.4 – 3.3 11 15 0.9 -10

5.6 2.4 – 3.3 17 21 1.3 -10

Ordering No. B132-H8884-X-X-7600

Printed in Germany

PS 01071. nb

P1-P2

BGA 700L16 E6327

Mfr. #:

Buy BGA 700L16 E6327

Manufacturer:

Infineon Technologies

Description:

IC AMP GSM 500MHZ-6GHZ TSLP7-1

Lifecycle:

New from this manufacturer.

Delivery:

DHL FedEx Ups TNT EMS

Payment:

T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet

BGA 700L16 E6327