AD7801
–3–
REV. 0
TIMING CHARACTERISTICS
1, 2
Limit at T
MIN
, T
MAX
Parameter (B Version) Units Conditions/Comments
t
1
0 ns min Chip Select to Write Setup Time
t
2
0 ns min Chip Select to Write Hold Time
t
3
20 ns min Write Pulse Width
t
4
15 ns min Data Setup Time
t
5
4.5 ns min Data Hold Time
t
6
20 ns min Write to LDAC Setup Time
t
7
20 ns min LDAC Pulse Width
t
8
20 ns min CLR Pulse Width
NOTES
1
Sample tested at +25°C to ensure compliance. All input signals are specified with tr = tf = 5 ns (10% to 90% of V
DD
) and timed from a voltage level of
(V
IL
+ V
IH
)/2. tr and tf should not exceed 1 µs on any digital input.
2
See Figure 1.
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7801 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS*
(T
A
= +25°C unless otherwise noted)
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Reference Input Voltage to AGND . . . .–0.3 V to V
DD
+ 0.3 V
Digital Input Voltage to DGND . . . . . .–0.3 V to V
DD
+ 0.3 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . .–0.3 V to +0.3 V
V
OUT
to AGND . . . . . . . . . . . . . . . . . . –0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
Commercial (B Version) . . . . . . . . . . . . . –40°C to +105°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . .+150°C
SSOP Package, Power Dissipation . . . . . . . . . . . . . . . 700 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 143°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . .+215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . .+220°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 870 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 74°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . .+215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . .+220°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
ORDERING GUIDE
Temperature Package
Model Range Option*
AD7801BR –40°C to +105°C R-20
AD7801BRU –40°C to +105°C RU-20
*R = Small Outline; RU = Thin Shrink Small Outline.
(V
DD
= +2.7 V to +5.5 V; GND = 0 V; Internal V
DD
/2 Reference. All specifications T
MIN
to T
MAX
unless otherwise noted.)
