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a
AD7801
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 617/329-4700 World Wide Web Site: http://www.analog.com
Fax: 617/326-8703 © Analog Devices, Inc., 1997
+2.7 V to +5.5 V, Parallel Input,
Voltage Output 8-Bit DAC
FUNCTIONAL BLOCK DIAGRAM
INPUT
REGISTER
DAC
REGISTER
I DAC
÷
2
POWER-ON
RESET
AD7801
V
OUT
AGND
PD CLR LDAC
REFIN V
DD
DGND
D7
D0
WR
CS
I/V
MUX
CONTROL
LOGIC
FEATURES
Single 8-Bit DAC
20-Pin SOIC/TSSOP Package
+2.7 V to +5.5 V Operation
Internal and External Reference Capability
DAC Power-Down Function
Parallel Interface
On-Chip Output Buffer Rail-to-Rail Operation
Low Power Operation 1.75 mA max @ 3.3 V
Power-Down to 1 mA max @ 258C
APPLICATIONS
Portable Battery Powered Instruments
Digital Gain and Offset Adjustment
Programmable Voltage and Current Sources
Programmable Attenuators
GENERAL DESCRIPTION
The AD7801 is a single, 8-bit, voltage out DAC that operates
from a single +2.7 V to +5.5 V supply. Its on-chip precision output
buffer allows the DAC output to swing rail to rail. The AD7801
has a parallel microprocessor and DSP compatible interface with
high speed registers and double buffered interface logic. Data is
loaded to the input register on the rising edge of CS or WR.
Reference selection for the AD7801 can be either an internal
reference derived from the V
DD
or an external reference applied
at the REFIN pin. The output of the DAC can be cleared by
using the asynchronous CLR input.
The low power consumption of this part makes it ideally suited
to portable battery operated equipment. The power consump-
tion is less than 5 mW at 3.3 V, reducing to less than 3 µW in
power-down mode.
The AD7801 is available in a 20-lead SOIC and a 20-lead
TSSOP package.
PRODUCT HIGHLIGHTS
1. Low Power, Single Supply operation. This part operates
from a single +2.7 V to +5.5 V supply and consumes typically
5 mW at 3 V, making it ideal for battery powered applications.
2. The on-chip output buffer amplifier allows the output of the
DAC to swing rail to rail with a settling time of typically 1.2 µs.
3. Internal or external reference capability.
4. High speed parallel interface.
5. Power-down capability. When powered down the DAC
consumes less than 1 µA at 25°C.
6. Packaged in 20-lead SOIC and TSSOP packages.
