1
2015.4
Features
1.
Allows for direct soldering of wires to the PCB
The MDF12 and MDF27 eliminates the traditional
crimp housing/receptacle combination by crimping
the contact on to the wire and then directly soldering
it to the PCB. This improves assembly times and
connection reliability.
Has temporary PCB hold retention ability which allows
for easier soldering and helps to reduces labor costs.
The contact crimps both around the center
conductor and the jacket. The jacket crimp prevents
breakage or damage to the center conductor at the
solder joint by transferring stress to the jacket
portion of the terminated wire.
2. Vertical and right angle versions
The MDF12 contact is designed for when a vertical
connection to the PCB is needed. Please use the
MDF27 contact for applications that require a right
angle orientation.
3.
Supports larger gauge wires and higher
current ratings
The MDF12 and MDF27 can be used with wire diameters
ranging from 22 to 14 AWG and provides for a current
capacity of up to 15 A when using 14 AWG.
Contacts are suitable for use with readily available
UL1007 and UL1015 wire types.
Product specifi cations
Rated value
Rated current
(Note 1)
14 AWG : 15A
16 AWG : 10A
18 AWG : 9A
20 AWG : 5A
22 AWG : 5A
Operating temperature range
Operating humidity range
-35 to 85 ç (Note 2)
20 to 80 %
Rated voltage 300V AC
Storage temperature range
Storage humidity range
-10 to 60 ç (Note 3)
40 to 70 % (Note 3)
Items Specifi cations Conditions
1. Crimp Contact
resistance
15 mø min. Measured at 100 mA
2. Vibration
resistance
No damaged or loosened parts.
Frequency: 10 to 55 Hz; half amplitude: 0.75 mm,
in 3 directions for 2 hours
3. Moisture
resistance
No damaged or loosened parts.
Left for 96 hours at a temperature of 40 ç ±2 ç and with
humidity of 90 to 95 %
4. Temperature
cycle
No damaged or loosened parts.
(-55 ç for 30 minutes
→
5 to 35 ç for 10 minutes
→
85 ç
for 30 minutes
→
5 to 35 ç for 10 minutes) in 5 cycles
for 5 cycles
5. Solder heat
resistance
No loosening affecting the performance.
Flow: 250 ç for
10 seconds
Hand soldering: soldering iron
temperature 300 ç for 3 seconds
Note 1: The rated current differs depending on the wire size used.
Note 2: Includes the temperature rise when energized.
Note 3: Storage described here indicates the long-term-storage of unused items before they are mounted on PCB.
Operating humidity range applies to the non-energized state after the items are mounted on PCB.
Material
Product Component Material Finish
Crimping contact Contact Brass Tin plating
Note: Our tin plating process helps prevent whiskering.
MDF12/27 Series
Crimp Contact for Direct Joining Thick Wire PCB
Thick Wire Crimp Contact for Direct Soldering to PCB
Apr.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
