Unmate connector.
Steam age for 8 hour ± 15 min.
(precondition: Condition C)
SMT
Surface mount process simulation test
Solder paste is deposited onto screen
(e.g.ceramic plate) via stencil.
The connectors are placed onto the
solder paste print.
Subject the substrate and component to
the reflow process through a convection
oven.
Refer to section10.0 for temperature
profile.
Flux type: ROL0
THRU-HOLES
Dip and look test
Dip solder tails into solder pot at a
temperature of 245 ± 5°c for 5 ± 0.5 sec.
Emersion rate: 25.4 +/-6.4 mm /sec
Flux type: rol1
(JESD22-B-102E; Method 1 and 2)
SMT
Convection reflow
Sample to be passed through reflow over
according to temperature profiles (shown
in section10.0)
(EIA-364-56C, Procedure 6)
THRU-HOLES
WAVE solder terminations
Sample to be mounted on pcb and
passed through oven according to
temperature profiles (shown in section
10.0)