NCP330
www.onsemi.com
3
MAXIMUM RATINGS
Rating Symbol Value Unit
IN, OUT, EN, Pins: V
EN
,
V
IN
,
V
OUT
−0.3 to + 7.0 V
From IN to OUT Pins: Input/Output V
IN
,
V
OUT
−7.0 to + 7.0 V
ESD Withstand Voltage (IEC 61000−4−2) (Note 1)
(IN and OUT when bypassed with 1.0 mF capacitor minimum)
ESD IEC 15 Air, 8 contact kV
Human Body Model (HBM) ESD Rating are (Notes 2 and 3) ESD HBM 4000 V
Machine Model (MM) ESD Rating are (Notes 2 and 3) ESD MM 200 V
Latch−up protection (Note 4)
− Pins IN, OUT, EN
LU 100
mA
Maximum Junction Temperature Range T
J
−40 to + 125 °C
Storage Temperature Range T
STG
−40 to + 150 °C
Moisture Sensitivity (Note 5) MSL Level 1
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Guaranteed by design.
2. According to JEDEC standard JESD22−A108.
3. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115 for all pins.
4. Latch up Current Maximum Rating: ±100 mA per JEDEC standard: JESD78 class II.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Conditions Min Typ Max Unit
V
IN
Operational Power Supply 1.8 5.5 V
V
EN
Enable Voltage 0 5.5
T
A
Ambient Temperature Range − 40 25 + 85 °C
T
J
Junction Temperature Range − 40 25 + 125 °C
C
IN
Decoupling input capacitor 1
mF
C
OUT
Decoupling output capacitor USB port per Hub 1
mF
R
q
JA
Thermal Resistance Junction to Air UDFN−4 package (Note 6) 170 °C/W
I
OUT
Maximum DC current UDFN−4 package 3 A
I peak Maximum Peak current 1 ms at 217 Hz (GSM calibration) 5 A
P
D
Power Dissipation Rating (Note 7)
T
A
≤ 25°C UDFN−4 package 0.58
W
T
A
= 85°C UDFN−4 package 0.225
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
6. The R
q
JA
is dependent of the PCB heat dissipation.
7. The maximum power dissipation (P
D
) is given by the following formula:
P
D
+
T
JMAX
* T
A
R
qJA
