SL2304NZZC-1

Rev 2.1, May 6, 2008 Page 7 of 9
SL2304NZ
Switching Electrical Characteristics (I-Grade and VDD=3.3V)
Unless otherwise stated VDD= 3.3V+/- 10%, CL=15pF and Ambient Temperature range -40 to +85°C
Description
Symbol
Condition
Min
Typ
Max
Unit
Output Frequency Range
FOUT1
CL=15pF
DC
140
MHz
FOUT2
CL=30pF
DC
100
MHz
Output Rise/fall Time
tr/f-1
CL=15pF, measured at 0.8V to 2.0V
2.2
ns
Output Rise/Fall Time
tr/f-2
CL=30pF, measured at 0.8V to 2.0V
2.6
ns
Input Duty Cycle
DC1
Measured at VDD/2
20
80
%
Output Duty Cycle
DC2
CL=15pF, Fout=140MHz
Measured at VDD/2
45
55
%
Output Duty Cycle
DC3
CL=30pF, Fout=100MHz
Measured at VDD/2
40
60
%
Output to Output Skew
SKW1
Measured at VDD/2 and
Outputs are equally loaded
60
120
ps
Part to Part Skew
SKW2
Measured at VDD/2 and
Outputs are equally loaded
120
240
ps
Propagation Delay Time
PDT
Measured at VDD/2 from CLKIN to
Output Clock rising edge and Outputs
are equally loaded
1.2
2.5
3.8
ns
Cycle-to-Cycle Jitter
CCJ1
CLKIN=66MHz and CL=15
80
160
ps
Cycle-to-Cycle Jitter
CCJ2
CLKIN=133MHz and CL=15
60
120
ps
External Components & Design Considerations
Typical Application Schematic
SL2304NZ
0.1μF
CLKIN
CLK2
CLK3
GND
VDD
1
6
4
8
5
3
CL
CLK1
CL
CL
CL
CLK4
7
OE 2
Recommendations
Decoupling Capacitor: A decoupling capacitor of 0.1μF must be used between VDD and VSS pins. Place the
capacitor on the component side of the PCB as close to the VDD pin as possible. The PCB trace to the VDD pin and
to the GND via should be kept as short as possible. Do not use vias between the decoupling capacitor and the VDD
pin.
Not Recommended
for New Designs
Rev 2.1, May 6, 2008 Page 8 of 9
SL2304NZ
Package Outline and Package Dimensions
8-Pin TSSOP (4.4 mm)
1 4
8 5
6.250(0.246)
6.500(0.256)
4.300(0.169)
4.500(0.177)
2.900(0.114)
3.100(0.122)
0.850(0.033)
0.950(0.037)
0.190(0.007)
0.300(0.012)
0.650(0.025)
BSC
0.050(0.002)
0.150(0.006)
1.100(0.043) MAX
0.076(0.003)
0 to 8°
0.500(0.020)
0.700(0.027)
0.250(0.010)
BSC
Gauge
Plane
0.090(0.003)
0.200(0.008)
Dimensions are in milimeters(inches).
Top line: (MIN) and Bottom line: (Max)
Pin-1 ID
Seating Plane
Thermal Characteristics
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Thermal Resistance
Junction to Ambient
θ JA
Still air
-
110
-
°C/W
θ JA
1m/s air flow
-
100
-
°C/W
θ JA
3m/s air flow
-
80
-
°C/W
Thermal Resistance
Junction to Case
θ JC
Independent of air flow
-
35
-
°C/W
Not Recommended
for New Designs
Rev 2.1, May 6, 2008 Page 9 of 9
SL2304NZ
Ordering Information
[1]
Ordering Number
Marking
Shipping
Package
Package
Temperature
SL2304NZZC-1
SL2304NZC-1
Tube
8-pin TSSOP
0 to 70°C
SL2304NZZC-1T
SL2304NZC-1
Tape and Reel
8-pin TSSOP
0 to 70°C
SL2304NZZI-1
SL2304NZI-1
Tube
8-pin TSSOP
-40 to 85°C
SL2304NZZI-1T
SL2304NZI-1
Tape and Reel
8-pin TSSOP
-40 to 85°C
SL2304NZZC-1Z
SL2304NZC-1Z
Tube
8-pin TSSOP
0 to 70°C
SL2304NZZC-1ZT
SL2304NZC-1Z
Tape and Reel
8-pin TSSOP
0 to 70°C
SL2304NZZI-1Z
SL2304NZI-1Z
Tube
8-pin TSSOP
-40 to 85°C
SL2304NZZI-1ZT
SL2304NZI-1Z
Tape and Reel
8-pin TSSOP
-40 to 85°C
Notes:
1. The SL2304NZ products are RoHS compliant.
Not Recommended
for New Designs

SL2304NZZC-1

Mfr. #:
Manufacturer:
Silicon Labs
Description:
Clock Buffer 0 to 140MHz, 4 Outputs Fanout Buffer (NZDB), 3.3V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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