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TNPW06036K34BEEA

P1-P3P4-P6P7-P9P10-P10
www.vishay.com For technical questions, contact: thinfilmchip@vishay.com
Document Number: 28758
342 Revision: 27-Jun-12
TNPW e3
Vishay
High Stability Thin Film Flat Chip Resistors
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TEST AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
IEC 60115-1, generic specification (includes tests)
EN 140400, sectional specification (includes schedule for
qualification approval)
EN 140401-801, detail specification (includes schedule for
conformance inspection)
The testing also covers most of the requirements specified
by EIA/IS-703 and JIS-C-5202. The tests are carried out
under standard atmospheric conditions in accordance with
IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated
temperature range: Lower category temperature, upper
category temperature; damp heat, long term, 56 days) is
valid. Unless otherwise specified the following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
The components are mounted for testing on boards in
accordance with EN 60115-1, 4.31 unless otherwise
specified. The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-801.
10 000 V
1000 V
100 V
10 V
10 µs
Pulse Duration
t
i
Permissible pulse voltage
U
i, max.
100 µs 1 ms 10 ms 100 ms 1 s 10 s
TNPW1206 e3
TNPW0805 e3
TNPW0603 e3
Conditions:
P
i
≤
P
i, max.
Maximum pulse voltage
U
i, max.
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2
TEST METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE
Stability for product types:
TNPW0402 e3
TNPW0603 e3
TNPW0805 e3
TNPW1206 e3
TNPW1210 e3
TNPW2010 e3
TNPW2512 e3
4.5 - Resistance ± 1 %; ± 0.5 %; ± 0.1 %
4.8.4.2 -
Temperature
coefficient
At (20/- 55/20) C and
(20/125/20) °C
± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K
4.25.1 -
Endurance at
70 C
U = or
U = U
max.
;
whichever is the less severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (0.05 % R +0.01)
70 C; 8000 h ± (0.1 % R +0.02)
4.25.3 -
Endurance at
upper category
temperature
125 °C; 1000 h
155 °C; 1000 h
± (0.05 % R + 0.01 )
± (0.1 % R + 0.02 )
P
70
x R
Document Number: 28758 For technical questions, contact: thinfilmchip@vishay.com
www.vishay.com
Revision: 27-Jun-12 343
TNPW e3
High Stability Thin Film Flat Chip Resistors
Vishay
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
4.24 78 (Cab)
Damp heat,
steady state
(40±2) °C; 56 days;
(93 ± 3) % RH
± (0.1 % R + 0.01 )
4.23
Climatic
sequence:
±(0.1 % R +0.02 )
4.23.2 2 (Bb) Dry heat UCT; 16 h
4.23.3 30 (Db) Damp
55 °C; 24 h; > 90 % RH;
1 cycle
4.23.4 1 (Ab) Cold LCT; 2 h
4.23.5 13 (M) Low air 8.5 kPa; 2 h; 25 ± 10 °C
4.23.6 30 (Db)
Damp heat,
cyclic
55 °C; 5 days;
> 95 to 100 % RH; 5 cycles
4.23.7 - DC load
U = U
max.
; 1 min
LCT = - 55 °C
UCT = 125 °C
- 1 (Ab) Cold - 55 °C; 2 h ±(0.05 % R +0.01 )
4.19 14 (Na)
Rapid change
of temperature
30 min at LCT and
30 min at UCT;
LCT = - 55 °C; UCT = 125 °C;
1000 cycles
±(0.1 % R +0.01 )
4.13 -
Short time
overload
U = 2.5 x or
U =2 x U
max.
; whichever is the
less severe; 5 s
±(0.05 % R +0.01 )
4.27 -
Single pulse
high voltage
overload
Severity no. 4:
U = 10 x or
U =2 x U
max.
;
whichever is the less severe;
10 pulses 10 µs/700 µs
±(0.5 % R +0.05 )
no visible damage
4.37 -
Periodic
electric
overload
U = or
U =2 x U
max.
;
whichever is the less severe;
0.1 s on; 2.5 s off;
1000 cycles
±(0.5 % R +0.05 )
no visible damage
4.22 6 (Fc) Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude 1.5 mm or
200 m/s
2
; 7.5 h
±(0.05 % R +0.01 )
no visible damage
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2
TEST METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE
Stability for product types:
TNPW0402 e3
TNPW0603 e3
TNPW0805 e3
TNPW1206 e3
TNPW1210 e3
TNPW2010 e3
TNPW2512 e3
P
70
x R
P
70
x R
P
70
x R
15 x P
70
x R
www.vishay.com For technical questions, contact: thinfilmchip@vishay.com
Document Number: 28758
344 Revision: 27-Jun-12
TNPW e3
Vishay
High Stability Thin Film Flat Chip Resistors
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
4.17.2 58 (Td) Solderability
Solder bath method;
SnPb40; non-activated flux
(215 ± 3) °C; (3 ± 0.3) s
Good tinning ( 95 % covered);
no visible damage
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
non-activated flux
(235 ± 3) °C; (2 ± 0.2) s
4.18.2 58 (Td)
Resistance to
soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
±(0.02 % R +0.01)
4.29 45 (XA)
Component
solvent
resistance
Isopropyl alcohol + 50 °C;
method 2
No visible damage
4.32 21 (Ue
3
)
Shear
(adhesion)
RR 1005M and RR 1608M;
9 N
No visible damage
RR 2012M and RR 3216M:
45 N
4.33 21 (Ue
1
)
Substrate
bending
Depth 2 mm, 3 times
±(0.05 % R +0.01)
no visible damage, no open circuit in bent position
4.7 - Voltage proof U
RMS
= U
ins
; 60 ± 5 s No flashover or breakdown
4.35 - Flammability
IEC 60695-11-5,
needle flame test; 10 s
No burning after 30 s
- - Damp heat
(85 ±5) °C; 56 days
(85 ±5) % RH
± (0.25 R + 0.05 )
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2
TEST METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE
Stability for product types:
TNPW0402 e3
TNPW0603 e3
TNPW0805 e3
TNPW1206 e3
TNPW1210 e3
TNPW2010 e3
TNPW2512 e3
P1-P3P4-P6P7-P9P10-P10

TNPW06036K34BEEA

Mfr. #:
Buy TNPW06036K34BEEA
Manufacturer:
Vishay / Dale
Description:
Thin Film Resistors - SMD 6.34Kohms .1% 25ppm
Lifecycle:
New from this manufacturer.
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