VS-GB200TS60NPbF
www.vishay.com
Vishay Semiconductors
Revision: 10-Jun-15
1
Document Number: 94503
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, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
INT-A-PAK “Half Bridge”
(Ultrafast Speed IGBT), 209 A
FEATURES
• Generation 5 Non Punch Through (NPT)
technology
• Ultrafast: optimized for hard switching speed
•Low V
CE(on)
• 10 μs short circuit capability
• Square RBSOA
•Positive V
CE(on)
temperature coefficient
•HEXFRED
®
antiparallel diode with ultrasoft reverse
recovery characteristics
• Industry standard package
•Al
2
O
3
DBC
• UL approved file E78996
• Designed for industrial level
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
BENEFITS
• Benchmark efficiency for UPS and welding application
• Rugged transient performance
• Direct mounting on heatsink
• Very low junction to case thermal resistance
PRODUCT SUMMARY
V
CES
600 V
I
C
DC 209 A
V
CE(on)
at 200 A, 25 °C 2.6 V
Speed 8 kHz to 30 kHz
Package INT-A-PAK
Circuit Half bridge with SMD gate resistor
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS MAX. UNITS
Collector to emitter voltage V
CES
600 V
Continuous collector current I
C
T
C
= 25 °C 209
A
T
C
= 80 °C 142
Pulsed collector current I
CM
400
Clamped inductive load current I
LM
400
Diode continuous forward current I
F
T
C
= 25 °C 178
T
C
= 80 °C 121
Gate to emitter voltage V
GE
± 20 V
Maximum power dissipation P
D
T
C
= 25 °C 781
W
T
C
= 80 °C 438
Isolation voltage V
ISOL
Any terminal to case, t = 1 min 2500 V
Operating junction temperature range T
J
-40 to +150 °C