Test Test methods/conditions Requirement
Solderability IEC 60068-2-20, test Ta,
method 1 with modified conditions for
lead-free solder alloys: 245 °C, 3 s:
After dipping the terminals to a depth of
approximately 3 mm from the body in a
soldering bath of 245 °C for 3 s, the
terminals shall be visually examined.
The inspection shall be
carried out under adequate
light with normal eyesight or
with the assistance of a
magnifier capable of giving
a magnification of 4 to
10 times. The dipped
surface shall be covered
with a smooth and bright
solder coating with no more
than small amounts of
scattered imperfections
such as pinholes or
un-wetted or de-wetted
areas. These imperfections
shall not be concentrated in
one area.
Resistance to soldering
heat
IEC 60068-2-20, test Tb, method 1A,
260 °C, 10 s:
Each lead shall be dipped into a solder
bath having a temperature of 260 ±5 °C
to a point 2.0 to 2.5 mm from the body
of the specimen, be held there for
10 ±1 s and then be stored at room
temperature and normal humidity for
1 to 2 h.
The change of V
V
shall be measured
and the specimen shall be visually
examined.
|∆V/V (1 mA)| ≤5%
No visible damage
Tensile strength IEC 60068-2-21, test Ua1
After gradually applying the force
specified below and keeping the unit
fixed for 10 s, the terminal shall be
visually examined for any damage.
Force for wire diameter:
0.6 mm = 10 N
0.8 mm = 10 N
1.0 mm = 20 N
|∆V/V (1 mA)| ≤5%
No break of solder joint,
no wire break
Housed varistors ETFV25
ThermoFuse varistors, ETFV25 series
Page 7 of 15Please read Cautions and warnings and
Important notes at the end of this document.
