FCP125N65S3R0

FCP125N65S3R0
www.onsemi.com
4
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics
Figure 3. On-Resistance Variation vs. Drain
Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current and Temperature
Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics
0.1
0.1
1
10
100
I
D
, Drain Current [A]
V
DS
, DrainSource Voltage [V]
3
1
10
100
I
D
, Drain Current [A]
V
GS
, GateSource Voltage [V]
69
0
0.0
0.1
0.2
0.3
R
DS(ON)
,
DrainSource OnResistance [
W]
I
D
, Drain Current [A]
0.0
0.001
0.01
0.1
1
10
100
*Notes:
1. V
GS
= 0 V
2. 250 ms Pulse Test
150
o
C
I
S
, Reverse Drain Current [A]
V
SD
, Body Diode Forward Voltage [V]
25
o
C
55
o
C
10 20 30 40 50
0.5 1.0 1.5
0.1 1 10 100 1000
0.1
1
10
100
1000
10000
100000
C
oss
C
iss
C
iss
= C
gs
+ C
gd
(C
ds
oss
= C
ds
+ C
gd
C
rss
= C
gd
*Note:
1. V
GS
= 0 V
2. f = 1 MHz
C
rss
Capacitances [pF]
V
DS
, DrainSource Voltage [V]
= shorted)
C
0 1020304050
0
2
4
6
8
10
V
DS
= 400 V
V
DS
= 130 V
*Note: I
D
= 12 A
V
GS
, GateSource Voltage [V]
Q
g
, Total Gate Charge [nC]
110
V
GS
= 10.0 V
8.0 V
7.0 V
6.5 V
6.0 V
5.5 V
*Notes:
1. 250 ms Pulse Test
2. T
C
= 255C
*Notes:
1. V
DS
= 20 V
2. 250 ms Pulse Test
1505C
255C
555C
*Note: T
C
= 255C
V
GS
= 10 V
V
GS
= 20 V
FCP125N65S3R0
www.onsemi.com
5
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variant vs. Temperature
Figure 9. Maximum Safe Operation Area Figure 10. Maximum Drain Current
vs. Case Temperature
Figure 11. E
OSS
vs. Drain to Source Voltage
50
0.8
0.9
1.0
1.1
1.2
*Notes:
1. V
GS
= 0 V
2. I
D
= 10 mA
BV
DSS
, [Normalized]
DrainSource Breakdown Voltage
T
J
, Junction Temperature [
o
C]
50
0.0
0.5
1.0
1.5
2.0
2.5
*Notes:
1. V
GS
= 10 V
2. I
D
= 12 A
R
DS(on)
, [Normalized]
DrainSource OnResistance
T
J
, Junction Temperature [
o
C]
0 50 100 150 0 50 100 150
25
0
5
10
15
20
25
I
D
, Drain Current [A]
T
C
, Case Temperature [
o
C]
50 100 150 200 250
0
0
2
4
6
8
10
E
OSS
[mJ]
V
DS
, Drain to Source Voltage [V]
130 260 390 520 650
1
0.01
0.1
1
10
100
10ms
30
ms
100ms
1ms
I
D
, Drain Current [A]
V
DS
, DrainSource Voltage [V]
Operation in This Area
is Limited by R
DS(on)
*Notes:
1. T
C
= 25
o
C
2. T
J
= 150
o
DC
10 100 1000
C
3. Single Pulse
FCP125N65S3R0
www.onsemi.com
6
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
Figure 12. Transient Thermal Response Curve
10
5
10
4
10
3
10
2
10
1
10
0
10
0.001
0.01
0.1
1
2
SINGLE PULSE
DUTY CYCLEDESCENDING ORDER
r(t), NORMALIZED EFFECTIVE TRANSIENT
THERMAL RESISTANCE
t, RECTANGULAR PULSE DURATION (sec)
D = 0.5
0.2
0.1
0.05
0.02
0.01
NOTES:
Z
qJC
(t) = r(t) x R
qJC
R
qJC
= 0.69
o
C/W
Duty Cycle, D = t
1
/ t
2
Peak T
J
= P
DM
x Z
qJC
(t) + T
C
P
DM
t
1
t
2

FCP125N65S3R0

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET SUPERFET3 650V 24A 125 mOhm
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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