CREAT BY ART
- Glass passivated junction chip.
- Ideal for automated placement
- Fast switching for high efficiency
- High surge current capability
- Halogen-free according to IEC 61249-2-21 definition
- AEC-Q101 available
The superior avalanche capability of BYG23M is specially
suited for free-wheeling, clamping, snubbering,
demagnetization in power supplies and other power switching applications.
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - green compound (halogen-free)
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
V
RRM
V
V
RMS
V
V
DC
V
I
F(AV)
A
t
rr
ns
C
J
pF
R
θJA
O
C/W
T
J
O
C
T
STG
O
C
Document Number: DS_D1411087 Version: B14
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
MECHANICAL DATA
Case: DO-214AC (SMA)
DO-214AC (SMA)
BYG23M
Taiwan Semiconductor
Hi
h Efficient Surface Mount Rectifiers
FEATURES
- Moisture sensitivity level: level 1, per J-STD-020
UNIT
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Polarity: Indicated by cathode band
Weight: 0.064 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERSTICS (T
A
=25°C unless otherwise noted)
PARAMETER SYMBOL BYG23M
1000
50
Maximum DC blocking voltage
Maximum average forward rectified current (@T
A
=65°C)
1.5
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
I
FSM
50
65
Typical junction capacitance (Note 3)
Maximum reverse current @ rated VR T
J
=25°C
T
J
=100°C
T
J
=125°C
I
R
μA
A
Maximum instantaneous forward voltage (Note 1)
@ 1 A
V
F
V
15
Storage temperature range
700
1000
1.7
1
E
RSM
30
- 55 to +150
Typical thermal resistance 70
TYPICAL APPLICATION
mJ
- 55 to +150
Note 2: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0Volts.
Note 1: Pulse Test with PW=300μs, 1% Duty Cycle
15
Pulse energy in avalanche mode, non repetitive
(Inductive load switch off ) T
A
=25℃, I
(BR)R
=1.23A
Maximum reverse recovery time (Note 2)
Operating junction temperature range
