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(315) 432-8909
(800) 544-2414
+44 2392-232392
Available on Tape and
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Manufacturing.
Typical Performance:
Power De-rating: Mounting Footprint and Procedure:
NOT RECOMMENDED APPLICATION
BOARD LOWER
THAN LEAD. THAN LEAD.
BOARD HIGHER
SCALE: NONESCALE: NONE
BOARD EVEN
WITH LEAD.THAN LEAD.
BOARD LOWER
SUGGESTED STRESS RELIEF METHODS
(2 PLACES)
.025 MIN.
SUGGESTED MOUNTING PROCEDURES:
1.
MAKE SURE THAT THE DEVICES ARE MOUNTED ON
FLAT SURFACES (.001" UNDER THE DEVICE) TO
OPTIMIZE THE HEAT TRANSFER.
DRILL & TAP THE HEATSINK FOR THE APPROPRIATE2.
THREAD SIZE TO BE USED.
3. COAT HEATSINK WITH A MINIMUM AMOUNT OF HIGH
QUALITY SILICONE GREASE (.001" MAX. THICKNESS).
4. POSITION DEVICE ON MOUNTING SURFACE & SECURE
USING SOCKET HEAD SCREWS, FLAT & SPLIT WASHER.
TORQUE SCREWS TO THE APPROPRIATE VALUE. MAKE
5.
SURE THAT THE DEVICE IS FLAT AGAINST THE HEATSINK.
(CARE SHOULD BE TAKEN TO AVOID UPWARD PRESSURE OF
THE LEADS TOWARDS THE LID).
SOLDER LEADS IN PLACE USING APPROPROATE SOLDER WITH
A CONTROLLED TEMPERATURE IRON.
** FOR MORE DETAILS CONTACT FACTORY **
60N50TP (097) Rev A
