AD976/AD976A
–4–
REV. C
All Grades
Parameter Conditions Min Typ Max Units
DIGITAL OUTPUTS
Data Format Parallel 16 Bits
Data Coding Binary Twos Complement
V
OL
I
SINK
= 1.6 mA +0.4 V
V
OH
I
SOURCE
= 500 µA+4 V
Leakage Current High-Z State, ±5 µA
V
OUT
= 0 V to V
DIG
Output Capacitance High-Z State 15 pF
DIGITAL TIMING
Bus Access Time 83 ns
Bus Relinquish Time 83 ns
POWER SUPPLIES
Specified Performance
V
DIG
4.75 5 5.25 V
V
ANA
4.75 5 5.25 V
I
DIG
3.0 mA
I
ANA
11 mA
Power Dissipation 100 mW
TEMPERATURE RANGE
Specified Performance –40 +85 °C
Specifications subject to change without notice.
TIMING SPECIFICATIONS
(AD976A: F
S
= 200 kHz; AD976: F
S
= 100 kHz; –40C to +85C, V
DIG
= V
ANA
= +5 V unless otherwise noted)
Symbol Min Typ Max Units
Convert Pulsewidth t
1
50 ns
Data Valid Delay after R/C Low (AD976A/AD976) t
2
4.0/8.0 µs
BUSY Delay from R/C Low t
3
83 ns
BUSY Low (AD976A/AD976) t
4
4.0/8.0 µs
BUSY Delay after End of Conversion (AD976A/AD976) t
5
180/360 ns
Aperture Delay t
6
40 ns
Conversion Time (AD976A/AD976) t
7
3.8/7.6 4.0/8.0 µs
Acquisition Time t
8
1.0/2.0 µs
Bus Relinquish Time t
9
10 35 83 ns
BUSY Delay after Data Valid (AD976A/AD976) t
10
50 180/360 ns
Previous Data Valid after R/C Low (AD976A/AD976) t
11
3.7/7.4 µs
Throughput Time (AD976A/AD976) t
7
+ t
8
5/10 µs
R/C to CS Setup Time t
12
10 ns
Time Between Conversions (AD976A/AD976) t
13
5/10 µs
Bus Access and Byte Delay t
14
10 83 ns
Specifications subject to change without notice.
AD976/AD976A
–5–
REV. C
ABSOLUTE MAXIMUM RATINGS
1
Analog Inputs
V
IN
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 V
CAP . . . . . . . . . . . . . . . . +V
ANA
+ 0.3 V to AGND2 – 0.3 V
REF . . . . . . . . . . . . . . . . . . . . . Indefinite Short to AGND2
Ground Voltage Differences
DGND, AGND1, AGND2 . . . . . . . . . . . . . . . . . . . . ±0.3 V
Supply Voltages
V
ANA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
V
DIG
to V
ANA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±7 V
V
DIG
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Digital Inputs . . . . . . . . . . . . . . . . . . . –0.3 V to V
DIG
+ 0.3 V
Internal Power Dissipation
2
PDIP (N), SOIC (R), SSOP (RS) . . . . . . . . . . . . . 700 mW
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Storage Temperature Range (N, R, RS) . . . –65°C to +150°C
Lead Temperature Range
(Soldering 10 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +300°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Specification is for device in free air:
28-Lead PDIP: θ
JA
= 74°C/W; θ
JC
= 24°C/W,
28-Lead SOIC: θ
JA
= 72°C/W; θ
JC
= 23°C/W,
28-Lead SSOP: θ
JA
= 109°C/W; θ
JC
= 39°C/W.
ORDERING GUIDE
Temperature Max Min Throughput Package Package
Model Range INL S/(N+D) Rate Descriptions Options
AD976AN –40°C to +85°C ±3.0 LSB 83 dB 100 kSPS 28-Lead, 300 mil Plastic DIP N-28B
AD976BN –40°C to +85°C ±2.0 LSB 85 dB 100 kSPS 28-Lead, 300 mil Plastic DIP N-28B
AD976CN –40°C to +85°C 83 dB 100 kSPS 28-Lead, 300 mil Plastic DIP N-28B
AD976AAN –40°C to +85°C ±3.0 LSB 83 dB 200 kSPS 28-Lead, 300 mil Plastic DIP N-28B
AD976ABN –40°C to +85°C ±2.0 LSB 85 dB 200 kSPS 28-Lead, 300 mil Plastic DIP N-28B
AD976ACN –40°C to +85°C 83 dB 200 kSPS 28-Lead, 300 mil Plastic DIP N-28B
AD976AR –40°C to +85°C ±3.0 LSB 83 dB 100 kSPS 28-Lead Small Outline Package R-28
AD976BR –40°C to +85°C ±2.0 LSB 85 dB 100 kSPS 28-Lead Small Outline Package R-28
AD976CR –40°C to +85°C 83 dB 100 kSPS 28-Lead Small Outline Package R-28
AD976AAR –40°C to +85°C ±3.0 LSB 83 dB 200 kSPS 28-Lead Small Outline Package R-28
AD976ABR –40°C to +85°C ±2.0 LSB 85 dB 200 kSPS 28-Lead Small Outline Package R-28
AD976ACR –40°C to +85°C 83 dB 200 kSPS 28-Lead Small Outline Package R-28
AD976ARS –40°C to +85°C ±3.0 LSB 83 dB 100 kSPS 28-Lead Shrink Small Outline Package RS-28
AD976BRS –40°C to +85°C ±2.0 LSB 85 dB 100 kSPS 28-Lead Shrink Small Outline Package RS-28
AD976CRS –40°C to +85°C 83 dB 100 kSPS 28-Lead Shrink Small Outline Package RS-28
AD976AARS –40°C to +85°C ±3.0 LSB 83 dB 200 kSPS 28-Lead Shrink Small Outline Package RS-28
AD976ABRS –40°C to +85°C ±2.0 LSB 85 dB 200 kSPS 28-Lead Shrink Small Outline Package RS-28
AD976ACRS –40°C to +85°C 83 dB 200 kSPS 28-Lead Shrink Small Outline Package RS-28
PIN CONFIGURATION
DIP, SOIC and SSOP Packages
14
13
12
11
10
9
8
2
3
4
7
6
5
1
TOP VIEW
(Not to Scale)
17
16
15
19
18
20
28
27
26
25
24
23
22
21
AD976
AD976A
V
IN
CS
BUSY
V
ANA
V
DIG
AGND1
REF
CAP
D0 (LSB)
BYTE
R/C
AGND2
D15 (MSB)
D14
D13
D12
D11
D3
D2
D1
D10
D9
D8
DGND
D4
D7
D6
D5
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD976/AD976A features proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
1.6mA I
OL
TO
OUTPUT
PIN
C
L
100pF
500mA
I
OH
+2.1V
Figure 1. Load Circuit for Digital Interface Timing
WARNING!
ESD SENSITIVE DEVICE
AD976/AD976A
–6–
REV. C
PIN FUNCTION DESCRIPTIONS
Pin No. Mnemonic Description
1V
IN
Analog Input. Connect a 200 resistor between V
IN
and the analog signal source. The full-scale
input range is ±10 V.
2 AGND1 Analog Ground. Used as the ground reference point for the REF pin.
3 REF Reference Input/Output. The internal +2.5 V reference is available at this pin. Alternatively, an
external reference can be used to override the internal reference. In either case, connect a 2.2 µF
tantalum capacitor between REF and AGND1.
4 CAP Reference Buffer Output. Connect a 2.2 µF tantalum capacitor between CAP and AGND2.
5 AGND2 Analog Ground.
6 D15 (MSB) Data Bit 15. Most significant bit of conversion result. High impedance state when CS is HIGH or
when R/C is LOW.
7–13 D14–D8 Data Bits 14–8. High impedance state when CS is HIGH or when R/C is LOW.
14 DGND Digital Ground.
15–21 D7–D1 Data Bits 7–1. High impedance state when CS is HIGH or when R/C is LOW.
22 D0 (LSB) Data Bit 0. Least significant bit of conversion result. High impedance state when CS is HIGH or
when R/C is LOW.
23 BYTE Byte Select. With BYTE LOW, data will be output as indicated above; Pin 6 (D15) is the MSB,
Pin 22 (D0) is the LSB. With BYTE HIGH, the top and bottom 8 bits of data will be switched;
D15–D8 are output on Pins 15–22 and D7–D0 are output on Pins 6–13.
24 R/C Read/Convert Input. With CS LOW, a falling edge on R/C puts the internal sample/hold into the
hold state and starts a conversion; a rising edge enables the output data bits.
25 CS Chip Select Input. Internally OR’d with R/C. With R/C LOW, a falling edge on CS will initiate a
conversion. With R/C HIGH, a falling edge on CS will enable the output data bits. When CS is
HIGH, the output data bits will be in the Hi-impedance state.
26 BUSY Busy Output. Goes LOW when a conversion is started and remains LOW until the conversion is
completed and the data is latched into the output register. With CS tied LOW and R/C HIGH,
output data will be valid when BUSY rises. The rising edge of BUSY can be used to latch the out-
put data.
27 V
ANA
Analog Power Supply. Nominally +5 V.
28 V
DIG
Digital Power Supply. Nominally +5 V.
DEFINITION OF SPECIFICATIONS
INTEGRAL NONLINEARITY ERROR (INL)
Linearity error refers to the deviation of each individual code
from a line drawn from “negative full scale” to “positive full
scale.” The point used as negative full scale occurs 1/2 LSB
before the first code transition. Positive full scale is defined as a
level 1 1/2 LSB beyond the last code transition. The deviation is
measured from the middle of each particular code to the true
straight line.
DIFFERENTIAL NONLINEARITY ERROR (DNL)
In an ideal ADC, code transitions are 1 LSB apart. Differential
nonlinearity is the maximum deviation from this ideal value. It
is often specified in terms of resolution for which no missing
codes are guaranteed.
FULL-SCALE ERROR
The last + transition (from 011. . .10 to 011. . .11) should
occur for an analog voltage 1 1/2 LSB below the nominal full
scale (9.9995422 V for a ±10 V range). The full-scale error is
the deviation of the actual level of the last transition from the
ideal level.
BIPOLAR ZERO ERROR
Bipolar zero error is the difference between the ideal midscale
input voltage (0 V) and the actual voltage producing the midscale
output code.
INPUT BANDWIDTH
The input bandwidth is that frequency at which the amplitude
of the reconstructed fundamental is reduced by 3 dB for a full-
scale input.
FULL-POWER BANDWIDTH
Full-power bandwidth is defined as the full-scale input fre-
quency at which signal to (Noise + Distortion) degrades to
60 dB, as 10 bits of accuracy.
APERTURE DELAY
Aperture delay is a measure of the Sample-and-Hold Amplifier
(SHA) performance and is measured from the rising edge of the
clock input to when the input signal is held for a conversion.

AD976CRZ

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 16-Bit 100 kSPS Parallel I/O
Lifecycle:
New from this manufacturer.
Delivery:
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