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ST6G3237 Package mechanical data
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6 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPAC
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
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Package mechanical data ST6G3237
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Table 12. µTFBGA25 Mechanical data
Dim.
mm. mils
Min. Typ. Max. Min. Typ. Max.
A 1.0 1.1 1.16 39.4 43.3 45.7
A1 0.25 9.8
A2 0.78 0.86 30.7 33.9
b 0.25 3.0 3.1 114.2 118.1 122.0
D 2.9 3.0 3.1 114.2 118.1 122.0
D1 2 78.8
E 2.9 3.0 3.1 114.2 118.1 122.0
E1 2 78.8
e 0.5 19.7
SE 0.25 9.8
Figure 5. Package dimensions
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ST6G3237 Package mechanical data
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Table 13. TSSOP20 Mechanical data
Dim.
mm. mils
Min. Typ. Max. Min. Typ. Max.
A 1.2 0.047
A1 0.05 0.15 0.002 0.004 0.006
A2 0.8 1 1.05 0.031 0.039 0.041
b 0.19 0.30 0.007 0.012
c 0.09 0.20 0.004 0.0079
D 6.4 6.5 6.6 0.252 0.256 0.260
E 6.2 6.4 6.6 0.244 0.252 0.260
E1 4.3 4.4 4.48 0.169 0.173 0.176
e 0.65 BSC 0.0256 BSC
K 0°
L 0.45 0.60 0.75 0.018 0.024 0.030
Figure 6. Package dimensions
c
E
b
A2
A
E1
D
1
PIN 1 IDENTIFICATION
A1
L
K
e
0087225C

ST6G3237TBR

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Translation - Voltage Levels Signal Switch Dual Supply lvl Trans
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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