Package and PC board thermal data VNQ5E050MK-E
28/36 Doc ID 16374 Rev 2
4 Package and PC board thermal data
4.1 PowerSSO-24 thermal data
Figure 32. PowerSSO-24 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB: Double layer, Thermal Vias, FR4
area= 77mm x 86mm, PCB thickness=1.6mm, Cu thickness=70µm (front and back side),
Copper areas: from minimum pad lay-out to 8cm
2
).
Figure 33.
R
thj-amb
vs. PCB copper area in open box free air condition (one channel ON)
30
35
40
45
50
55
0246810
RTHj_amb(°C/W)
PCB Cu heatsink area (cm^2)
