MAX8740ETB+T

MAX8740
TFT-LCD Step-Up DC-DC Converter
10 ______________________________________________________________________________________
Multiple-Output Power Supply for TFT LCD
Figure 3 shows a power supply for active-matrix TFT-
LCD flat-panel displays. Output-voltage transient perfor-
mance is a function of the load characteristic. Add or
remove output capacitance (and recalculate compensa-
tion-network component values) as necessary to meet
the required transient performance. Regulation perfor-
mance for secondary outputs (V2 and V3) depends on
the load characteristics of all three outputs.
PC Board Layout and Grounding
Careful PC board layout is important for proper operation.
Use the following guidelines for good PC board layout:
1) Minimize the area of high-current loops by placing
the inductor, rectifier diode, and output capacitors
near the input capacitors and near the LX and GND
pins. The high-current input loop goes from the
positive terminal of the input capacitor to the induc-
tor, to the IC’s LX pin, out of GND, and to the input
capacitor’s negative terminal. The high-current out-
put loop is from the positive terminal of the input
capacitor to the inductor, to the rectifier diode (D1),
and to the positive terminal of the output capacitors,
reconnecting between the output capacitor and
input capacitor ground terminals. Connect these
loop components with short, wide connections.
Avoid using vias in the high-current paths. If vias
are unavoidable, use many vias in parallel to
reduce resistance and inductance.
2) Create a power ground island (PGND) consisting of
the input and output capacitor grounds and GND
pins. Connect all of these together with short, wide
traces or a small ground plane. Maximizing the
width of the power ground traces improves efficien-
cy and reduces output voltage ripple and noise
spikes. Create an analog ground plane (AGND)
consisting of the feedback-divider ground connec-
tion, the COMP and SS capacitor ground connec-
tions, and the device’s exposed backside pad.
Connect the AGND and PGND islands by connect-
ing the GND pins directly to the exposed backside
pad. Make no other connections between these
separate ground planes.
LX LX
FB
GND
GND
FREQ
IN
COMP
SS
1
4
5
2
3
9
8
67
10
V
IN
4.5V TO 5.5V
SHDN
MAX8740
C1
10µF
6.3V
R4
10
C5
1µF
C4
33nF
C3
560pF
C6
68pF
L1
2.7µH
D1
R2
20k
1%
R3
47k
1%
R1
196k
1%
V2
+28V
C9
1µF
D2
D3
C7
0.1µF
C8
0.1µF
V3
-10V
C10
0.22µF
V
OUT
13.5V/800mA
C2
10µF
25V
C7
10µF
25V
Figure 3. Multiple-Output TFT-LCD Power Supply
MAX8740
TFT-LCD Step-Up DC-DC Converter
______________________________________________________________________________________ 11
3) Place the feedback voltage-divider-resistors as
close to the FB pin as possible. The divider’s center
trace should be kept short. Placing the resistors far
away causes the FB trace to become an antenna
that can pick up switching noise. Avoid running the
feedback trace near LX.
4) Place the IN pin bypass capacitor as close to the
device as possible. The ground connection of the
IN bypass capacitor should be connected directly
to GND pins with a wide trace.
5) Minimize the length and maximize the width of the
traces between the output capacitors and the load
for best transient responses.
6) Minimize the size of the LX node while keeping it
wide and short. Keep the LX node away from the
feedback node and analog ground. Use DC traces
as a shield if necessary.
Refer to the MAX8740 evaluation kit for an example of
proper board layout.
Chip Information
TRANSISTOR COUNT: 2746
PROCESS: BiCMOS
TFT-LCD Step-Up DC-DC Converter
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages
.)
MAX8740
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 12
© 2005 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc.
6, 8, &10L, DFN THIN.EPS
L
C
L
C
PIN 1
INDEX
AREA
D
E
L
e
L
A
e
E2
N
G
1
2
21-0137
PACKAGE OUTLINE, 6,8,10 & 14L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
-DRAWING NOT TO SCALE-
k
e
[(N/2)-1] x e
REF.
PIN 1 ID
0.35x0.35
DETAIL A
b
D2
A2
A1
COMMON DIMENSIONS
SYMBOL
MIN. MAX.
A
0.70 0.80
D 2.90 3.10
E
2.90 3.10
A1
0.00 0.05
L
0.20 0.40
PKG. CODE
N
D2 E2 e
JEDEC SPEC
b
[(N/2)-1] x e
PACKAGE VARIATIONS
0.25 MIN.k
A2 0.20 REF.
2.30±0.101.50±0.106T633-1 0.95 BSC MO229 / WEEA 1.90 REF0.40±0.05
1.95 REF0.30±0.05
0.65 BSC
2.30±0.108T833-1
2.00 REF0.25±0.05
0.50 BSC
2.30±0.1010T1033-1
2.40 REF0.20±0.05- - - -
0.40 BSC
1.70±0.10 2.30±0.1014T1433-1
1.50±0.10
1.50±0.10
MO229 / WEEC
MO229 / WEED-3
0.40 BSC
- - - - 0.20±0.05 2.40 REFT1433-2 14 2.30±0.101.70±0.10
T633-2 6 1.50±0.10 2.30±0.10 0.95 BSC
MO229 / WEEA
0.40±0.05 1.90 REF
T833-2 8 1.50±0.10 2.30±0.10
0.65 BSC MO229 / WEEC
0.30±0.05 1.95 REF
T833-3 8 1.50±0.10 2.30±0.10
0.65 BSC MO229 / WEEC
0.30±0.05 1.95 REF
-DRAWING NOT TO SCALE-
G
2
2
21-0137
PACKAGE OUTLINE, 6,8,10 & 14L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
DOWNBONDS
ALLOWED
NO
NO
NO
NO
YES
NO
YES
NO

MAX8740ETB+T

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
LCD Drivers TFT-LCD Step-Up DC/DC Converter
Lifecycle:
New from this manufacturer.
Delivery:
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