8
Notes:
1. GND Pin should be the most negative voltage at the detector side.
Keeping V
CC
as low as possible, but greater than 2.0 V, will provide
lowest total I
OH
over temperature.
2. Output power is collector output power plus total supply power for
the single channel device. For the dual channel device, output power
is collector output power plus one half the total supply power. For
the quad channel device, output power is collector output power
plus one fourth of total supply power. Derate at 1.66 mW/°C above
110°C.
3. Derate I
F
at 0.33 mA/°C above 110°C.
4. Each channel.
5. CURRENT TRANSFER RATIO is de ned as the ratio of output collector
current, I
O
, to the forward LED input current, I
F
, times 100%.
6. I
OHX
is the leakage current resulting from channel to channel optical
crosstalk. I
F
= 2 μA for channel under test. For all other channels,
I
F
= 10 mA.
7. All devices are considered two-terminal devices; measured between
all input leads or terminals shorted together and all output leads or
terminals shorted together.
8. Measured between each input pair shorted together and all output
connections for that channel shorted together.
9. Measured between adjacent input pairs shorted together for each
multi-channel device.
10. CM
L
is the maximum rate of rise of the common mode voltage that
can be sustained with the output voltage in the logic low state
(V
O
< 0.8 V). CM
H
is the maximum rate of fall of the common mode
voltage that can be sustained with the output voltage in the logic
high state (V
O
> 2.0 V).
11. In applications where dV/dt may exceed 50,000 V/s (such as
a static discharge) a series resistor, R
CC
, should be included to
protect the detector ICs from destructively high surge currents. The
recommended value is:
1 (V)
R
CC
= ————— k
0.15 I
F
(mA)
for single channel;
1 (V)
R
CC
= ————— k
0.3 I
F
(mA)
for dual channel;
1 (V)
R
CC
= ————— k
0.6 I
F
(mA)
for quad channel.
12. This is a momentary withstand test, not an operating condition.
13. Standard parts receive 100% testing at 25°C (Subgroups 1 and
9). SMD and 883B parts receive 100% testing at 25,125, and -55°C
(Subgroups 1 and 9, 2 and 10, 3 and 11, respectively).
14. Parameters tested as part of device initial characterization and
after design and process changes. Parameters guaranteed to limits
speci ed for all lots not speci cally tested.
