Continued from the preceding page.
Continued on the following page.
* "Room condition" Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
Let the capacitor sit at 40±2°C and relative humidity of 90 to 95%
for 500
+24
–0
hrs.
Remove and let sit for 24±2 hrs. at room condition,* then
measure.
U*ÀiÌÀi>ÌiÌ
Perform a heat treatment at 150
+0
–10
°C for 60±5 min. and then
let sit for 24±2 hrs. at room condition.*
15
Õ`ÌÞÊ
-Ìi>`ÞÊ
-Ì>Ìi®
««i>À>Vi
No marking defects
>«>VÌ>ViÊ
>}i
Within ±15%
D.F.
0.05 max.
I.R.
CU0.01μF: More than 10MΩs&
CF0.01μF: More than 1,000MΩ
iiVÌÀVÊ
-ÌÀi}Ì
In accordance with item No.4
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 5 cycles according to the 4 heat treatments listed in
the following table.
Let sit for 24±2 hrs. at room condition,* then measure.
U*ÀiÌÀi>ÌiÌ
Perform a heat treatment at 150
+0
–10
°C for 60±5 min. and then
let sit for 24±2 hrs. at room condition.*
Fig. 4
14
/i«iÀ>ÌÕÀiÊ
ÞVi
««i>À>Vi
No marking defects
>«>VÌ>ViÊ
>}i
Within ±7.5%
D.F.
0.025 max.
I.R.
CU0.01μF: More than 100MΩs&
CF0.01μF: More than 10,000MΩ
iiVÌÀVÊ
-ÌÀi}Ì
In accordance with item No.4
Preheat the capacitor at 120 to 150°C
*
for 1 min.
Immerse the capacitor in solder solution at 260±5°C for 10±1
sec. Let sit at room condition* for 24±2 hrs., then measure.
UiÀÃ}Êëii`\Ê25±2.5mm/s
U*ÀiÌÀi>ÌiÌ
Perform a heat treatment at 150
+0
–10
°C for 60±5 min. and then
let sit for 24±2 hrs. at room condition.*
*Preheating for more than 3.2Z2.5mm
13
,iÃÃÌ>ViÊ
ÌÊ-`iÀ}Ê
i>Ì
««i>À>Vi
No marking defects
>«>VÌ>ViÊ
>}i
Within ±10%
D.F.
0.025 max.
I.R.
CU0.01μF: More than 100MΩs&
CF0.01μF: More than 10,000MΩ
iiVÌÀVÊ
-ÌÀi}Ì
In accordance with item No.4
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Immerse in solder solution for 2±0.5 sec.
Immersing speed: 25±2.5mm/s
Temp. of solder: 245±5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)
235±5°C H60A or H63A Eutectic Solder
12
-`iÀ>LÌÞÊvÊ
/iÀ>Ì
75% of the terminations are to be soldered evenly and continuously.
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done using the reflow method and
should be conducted with care so that the soldering is uniform
and free of defects such as heat shock.
(in mm)
Fig. 3
11 iviVÌ
No marking defects
Fig. 2
° /iÃÌÊiÌ`-«iVvV>ÌÃÌi
b
a
c
100
40
ø4.5
t : 1.6
d
Capacitance meter
Flexure=1
20
50
R230
45 45
Pressurizing
speed: 1.0mm/s
Pressurize
LZW
®
iÃÊ®
>
1.0
1.2
2.2
2.2
3.5
4.5
L
3.0
4.0
5.0
5.0
7.0
8.0
V
1.2
1.65
2.0
2.9
3.7
5.6
`
1.0
1.6Z0.8
2.0Z1.25
3.2Z1.6
3.2Z2.5
4.5Z3.2
5.7Z5.0
-Ìi« /i«iÀ>ÌÕÀi
100 to 120°C
170 to 200°C
/i
1 min.
1 min.
1
2
-Ìi« /i«iÀ>ÌÕÀiÊc®
Min. Operating Temp.±3
Room Temp.
Max. Operating Temp.±2
Room Temp.
/iÊ°®
30±3
2 to 3
30±3
2 to 3
1
2
3
4
Solder resist
Cu
Glass Epoxy Board
Medium Voltage High Capacitance for General Use Specifications and Test Methods