MMBZ27VCL-7-F

MMBZ15VDL, MMBZ27VCL
Document number: DS30352 Rev. 15 - 2
1 of 5
www.diodes.com
October 2013
© Diodes Incorporated
MMBZ15VDL
,
MMBZ27VCL
40W PEAK POWER DUAL SURFACE MOUNT TVS
Features
Dual TVS in Common Cathode Configuration for ESD Protection
40 Watt Peak Power Dissipation @1.0ms (Unidirectional)
225mW Power Dissipation
Ideally Suited for Automated Insertion
Low Leakage
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3 & 4)
Mechanical Data
Case: SOT23
Case Material: Molded Plastic. UL Flammability Rating
Classification 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Solderable per MIL-STD-202, Method 208 Lead Free
Plating (Matte Tin Finish annealed over Alloy 42 leadframe).
Polarity: See Diagram
Weight: 0.008 grams (approximate)
Ordering Information (Note 5 & 6)
Part Number Compliance Case Packaging
MMBZ15VDL-7-F Standard SOT23 3000/Tape & Reel
MMBZ27VCL-7-F Standard SOT23 3000/Tape & Reel
MMBZ15VDLQ-7-F Automotive SOT23 3000/Tape & Reel
MMBZ27VCLQ-7-F Automotive SOT23 3000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Product manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.
5. Automotive products are AEC-Q101 qualified and are PPAP capable. Automotive, AEC-Q101 and standard products are electrically and thermally
the same, except where specified.
6. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Date Code Key
Year 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017
Code T U V W X Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
Top View
Device Schematic
SOT23
xx = Product Type Marking Code
YM = Date Code Marking for Shanghai
A
ssembly / Test site
Y = Year (ex: A = 2013)
M = Month (ex: 9 = September)
xx = Product Type Marking Code
= Date Code Marking for Chengdu
A
ssembly / Test site
= Year (ex: A = 2013)
M = Month (ex: 9 = September)
e3
Kxx
YM
Kxx
YM
YM
Y
MMBZ15VDL, MMBZ27VCL
Document number: DS30352 Rev. 15 - 2
2 of 5
www.diodes.com
October 2013
© Diodes Incorporated
MMBZ15VDL
,
MMBZ27VCL
Maximum Ratings (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Unit
Peak Power Dissipation (Note 7)
P
PK
40 W
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 8)
P
D
225 mW
Thermal Resistance, Junction to Ambient Air (Note 8)
R
JA
556 °C/W
Operating and Storage Temperature Range
T
J
, T
STG
-65 to +150 °C
Electrical Characteristics (@T
A
= +25°C, unless otherwise specified.)
V
F
= 0.9V max @ I
F
= 10mA
Type
Number
Marking
Code
V
RWM
Max
Reverse
Leakage I
R
@ V
RWM
(Note 9)
Breakdown Voltage
Max. Clamping
Voltage V
C
@
I
PP
(Note 7)
Typical
Temperature
Coefficient
V
BR
(Note 9) (V) @ I
T
V
C
I
PP
Volts nA Min Nom Max mA V A T
C
(%/°C)
MMBZ15VDL KVJ 12.8 100 14.3 15 15.8 1.0 21.2 1.9 +0.080
V
F
= 1.1V max @ I
F
= 200mA
Type
Number
Marking
Code
V
RWM
Max
Reverse
Leakage I
R
@ V
RWM
(Note 9)
Breakdown Voltage
Max. Clamping
Voltage V
C
@
I
PP
(Note 7)
Typical
Temperature
Coefficient
V
BR
(Note 9) (V) @ I
T
V
C
I
PP
Volts nA Min Nom Max mA V A T
C
(%/°C)
MMBZ27VCL KVP 22 50 25.65 27 28.35 1.0 38 1.0 +0.090
Notes: 7. Non-repetitive current pulse per Figure 2 and derate above T
A
= +25°C per Figure 1.
8. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes Inc. suggested pad layout AP02001, which can be found on our
website at http://www.diodes.com. 200mW per element must not be exceeded.
9. Short duration pulse test used to minimize self-heating effect.
10 X 1000 Waveform
as defined by REA
0 25 50 75 100 125 150 175 200
100
75
50
25
0
T , AMBIENT TEMPERATURE ( C)
Figure 1 Pulse Derating Curve
A
°
P
EAK
P
U
LSE DE
R
A
T
I
N
G
I
N
%
O
F
PEAK POWER OR CURRENT
I , PEAK PULSE CURRENT (%I )
PP pp
t, TIME (ms)
Figure 2 Pulse Waveform
MMBZ15VDL, MMBZ27VCL
Document number: DS30352 Rev. 15 - 2
3 of 5
www.diodes.com
October 2013
© Diodes Incorporated
MMBZ15VDL
,
MMBZ27VCL
0
50
100
200
150
250
300
025
50
75 100 125 150
175
P
,
P
O
WE
R
DISSI
P
A
T
I
O
N (mW)
D
T , AMBIENT TEMPERATURE
Figure 3 Steady State Power Derating Curve
A
FR-5 Board
Note 8
25
26
28
27
29
30
-15
-55
25
65
105 145
V, B
R
EAKD
O
WN V
O
L
T
A
G
E (V)
BR
T , AMBIENT TEMPERATURE (°C)
Figure 4 Typical Breakdown Voltage vs.
Temperature (MMBZ27VCL)
A
0.1
100
10
-15
-55
25 65 105
145
I , LEAKA
G
E
C
U
R
R
EN
T
(nA)
R
T , AMBIENT TEMPERATURE (°C)
Figure 5 Typical Leakage Current vs.
Temperature (MMBZ27VCL)
A
1
Unidirectional
0.1 1.0
PULSE WIDTH (ms)
Figure 6 Pulse Rating Curve, P (W) vs. Pulse Width (ms)
pk
Power is defined as P = V x I
pk C pp
0.1
10 100
1.0
10
1,000 10,000
T = 25°C
J
P , PEAK PULSE POWER (W)
pk
100
Non repetitive
pulse waveform
(Rectangular)
Unidirectional
Bidirectional
0.1 1.0
PULSE WIDTH (ms)
Figure 7 Pulse Rating Curve, P (W) vs. Pulse Width (ms)
pk (NOM)
Power is defined as P = V x I
where V is the nominal breakdown voltage
pk(NOM) BR(NOM) pp
BR(NOM)
0.1
10 100
1.0
10
1,000 10,000
T = 25C
J
°
P , PEAK PULSE POWER (W)
pk (NOM)
100
Non repetitive
pulse waveform
(Rectangular)
Unidirectional
Bidirectional

MMBZ27VCL-7-F

Mfr. #:
Manufacturer:
Diodes Incorporated
Description:
TVS Diodes / ESD Suppressors 225MW 22V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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