LTC3216
5
3216fc
2x Mode CPO Output Ripple
Charge Pump Mode Switching
and Input Current
TYPICAL PERFORMANCE CHARACTERISTICS
PIN FUNCTIONS
C2
+
, C1
+
, C2
–
, C1
–
(Pins 1, 2, 10, 12): Charge Pump
Flying Capacitor Pins. A 2.2µF X5R or X7R ceramic ca-
pacitor should be connected from C1
+
to C1
–
and from
C2
+
to C2
–
.
CPO (Pin 3): Output. CPO is the output of the charge
pump. This pin may be enabled or disabled using the EN1
and EN2 inputs. A 4.7µF X5R or X7R ceramic capacitor is
required from CPO to GND.
I
SET1
/I
SET2
(Pins 4, 6): LED Current Programming Resistor
Pins. The I
SET1
and I
SET2
pins will servo to 1.22V. Resistors
connected between each of these pins and GND are used
to set the high and low LED current levels. Connecting
a resistor of 2k or less will cause the LTC3216 to enter
overcurrent shutdown mode.
I
LED
(Pin 5): Output. I
LED
is the LED current source output.
The LED is connected between CPO (anode) and I
LED
(cathode). The current into the I
LED
pin is set via the EN1
and EN2 inputs, and the programming resistors connected
from I
SET2
and I
SET1
to GND.
EN1/EN2 (Pins 7, 8): Inputs. The EN1 and EN2 pins are
used to select which current level is being supplied to the
LED, as well as to put the part into shutdown mode. The
truth table for these pins is as follows:
Truth Table
EN1 EN2 MODE
0 0 Shutdown
1 0 Low Current
0 1 High Current
1 1 Low + High Current
V
IN
(Pin 9): Power. Supply voltage for the LTC3216. V
IN
should be bypassed with a 2.2µF or greater low impedance
ceramic capacitor to GND.
GND (Pin 11): Charge Pump Ground. This pin should be
connected directly to a low impedance ground plane.
Exposed Pad (Pin 13): Control Signal Ground. This pad
must be soldered to a low impedance ground plane for
optimum thermal and electrical performance.
(T
A
= 25°C unless otherwise specifi ed)
3216 G12
V
CPO
20mV/DIV
A/C COUPLED
500ns/DIVV
IN
= 3.6V
I
CPO
= 400mA
1ms/DIV
EN2
5V/DIV
I
VIN
500mA/DIV
V
CPO
1V/DIV
3216 G13
V
IN
= 3V