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PS2703-1-F3-K-A

P1-P3P4-P6P7-P9P10-P12P13-P13
PS2703-1
300
250
150
50
0
200
100
0.1 0.5 5
50
110
Forward Current I
F
(mA)
Current Transfer Ratio CTR (%)
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
V
CE
= 5 V
V
CC
= 5V,
I
C
= 2 mA
100
0.1
10
1
10 1 k
10 k
100
Load Resistance R
L
(Ω)
SWITCHING TIME vs.
LOAD RESISTANCE
Switching Time t ( s)
µ
t
d
t
f
t
r
t
s
1.2
0.4
0.0
1.0
0.6
0.2
0.8
500
1100.5 50 1005
Frequency f (kHz)
Normalized Gain G
V
FREQUENCY RESPONSE
R
L
= 1 kΩ
510 Ω
300 Ω
100 Ω
I
F
= 5 mA, V
CC
= 5 V,
CTR = 90 %
1 000
100
10
1
0.1
1 10 100
Load Resistance R
L
(kΩ)
SWITCHING TIME vs.
LOAD RESISTANCE
Switching Time t ( s)
µ
t
f
t
s
t
r
t
d
1.2
1.0
0.0
0.4
0.2
0.8
0.6
10
2
10
3
110
4
10
5
10
6
Time (Hr)
LONG TIME CTR DEGRADATION
CTR Dgradation (Relative Value)
I
F
= 1 mA, T
A
= 25 ˚C
I
F
= 5 mA, T
A
= 25 ˚C
I
F
= 20 mA, T
A
= 25 ˚C
I
F
= 20 mA, T
A
= 60 ˚C
1.2
0.6
0.0
0.8
1.0
0.4
0.2
025
50
100–55 –25
75
Ambient Temperature T
A
(˚C)
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
Normalized Current Transfer Ratio CTR
Normalized to 1.0
at T
A
= 25 ˚C,
I
F
= 5 mA, V
CE
= 5 V
Remark The graphs indicate nominal characteristics.
Data Sheet PN10242EJ02V0DS
7
PS2703-1
TAPING SPECIFICATIONS (in millimeters)
Tape Direction
Outline and Dimensions (Reel)
Packing: 3 500 pcs/reel
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
330±2.0
φ
100±1.0
φ
2.0±0.5
11.9 to 15.4
Outer edge of
flange
17.5±1.0
13.5±1.0
13.0±0.2
φ
PS2703-1-F3
PS2703-1-F4
1.55±0.1
2.0±0.05
4.0±0.1
1.75±0.1
4.6±0.1
2.9 MAX.
0.3
8.0±0.1
Outline and Dimensions (Tape)
2.4±0.1
1.5
+0.1
–0
7.4±0.1
5.5±0.05
12.0±0.2
Data Sheet PN10242EJ02V0DS
8
PS2703-1
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature 260°C or below (package surface temperature)
• Time of peak reflow temperature 10 seconds or less
• Time of temperature higher than 220°C 60 seconds or less
• Time to preheat temperature from 120 to 180°C 120±30 s
• Number of reflows Three
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
120±30 s
(preheating)
220˚C
180˚C
Package Surface Temperature T (˚C)
Time (s)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
to 60 s
260˚C MAX.
120˚C
(2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
• Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
• Number of times One (Allowed to be dipped in solder including plastic mold portion.)
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
• Peak temperature (lead part temperature) 350°C or below
• Time (each pins) 3 seconds or less
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
Data Sheet PN10242EJ02V0DS
9
P1-P3P4-P6P7-P9P10-P12P13-P13

PS2703-1-F3-K-A

Mfr. #:
Buy PS2703-1-F3-K-A
Manufacturer:
Renesas Electronics
Description:
Transistor Output Optocouplers Hi-Iso Photo 1-Ch
Lifecycle:
New from this manufacturer.
Delivery:
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