Low Voltage Stepper and Single/Dual DC Motor Driver
A3906
10
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ES Package, 20-Contact QFN with Exposed Thermal Pad
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Allegro MicroSystems, LLC reserves the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be required to
permit improvements in the per for mance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that
the information being relied upon is current.
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0.95
C
SEATING
PLANE
C0.08
21X
20
20
2
1
1
2
20
2
1
A
A
Terminal #1 mark area
Coplanarity includes exposed thermal pad and terminals
B
Exposed thermal pad (reference only, terminal #1
identifier appearance at supplier discretion)
For Reference Only
(reference JEDEC MO-220WGGD)
Dimensions in millimeters
Exact case and lead configuration at supplier discretion within limits shown
C
D
D
C
Reference land pattern layout (reference IPC7351
QFN50P400X400X80-21BM)
All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary
to meet application process requirements and PCB layout tolerances; when
mounting on a multilayer PCB, thermal vias at the exposed thermal pad land
can improve thermal dissipation (reference EIA/JEDEC Standard JESD51-5)
4.10
0.30
0.50
4.10
0.50
0.75 ±0.05
2.45
2.45
0.25
+0.05
–0.07
0.40
+0.15
–0.10
4.00 ±0.15
4.00 ±0.15
2.45
2.45
B
PCB Layout Reference View
