NCS214SQT2G

NCS210, NCS211, NCS212, NCS213, NCS214, NCS215
www.onsemi.com
4
Table 4. ELECTRICAL CHARACTERISTICS
Boldface limits apply over the specified temperature range, T
A
= −40°C to 125°C, guaranteed by characterization and/or design.
At T
A
= +25°C, V
SENSE
= V
IN+
− V
IN−.
NCS210, NCS213, NCS214 and NCS215: V
S
= +5 V, V
IN+
= 12 V, and V
REF
= V
S
/2, unless otherwise noted.
NCS211 and NCS212: V
S
= +12 V, V
IN+
= 12 V, and V
REF
= V
S
/2, unless otherwise noted.
Parameter UnitMaxTypMinSymbolTest Conditions
DYNAMIC PERFORMANCE
Bandwidth (f
−3dB
) C
LOAD
= 10 pF, NCS210
C
LOAD
= 10 pF, NCS211
C
LOAD
= 10 pF, NCS212
C
LOAD
= 10 pF, NCS213
C
LOAD
= 10 pF, NCS214
C
LOAD
= 10 pF, NCS215
BW 40
25
10
100
60
50
kHz
Slew Rate SR 0.4
V/ms
NOISE
Spectral Density, 1 kHz (RTI Note 6) e
n
35 nV/ǠHz
POWER SUPPLY
Operating Voltage Range V
SENSE
= 0 mV V
s
2.7 26 V
Quiescent Current V
SENSE
= 0 mV I
DD
65 100
mA
Quiescent Current over Temperature V
SENSE
= 0 mV 115
mA
Power Supply Rejection Ratio V
S
= +2.7 V to +26 V, V
IN+
=18 V,
V
SENSE
= 0 mV
PSRR ±0.1 ±10
mV/V
6. RTI = referenced−to−input.
ORDERING INFORMATION
Device Gain Marking Package Shipping
NCS210SQT2G 200 AAP
SC70−6
(Pb−Free)
3000 / Tape and Reel
NCS211SQT2G 500 AAM
NCS212SQT2G (In Development)** 1000 AAN
NCS213SQT2G (In Development)** 50 AAQ
NCS214SQT2G (In Development)** 100 AAR
NCS215SQT2G (In Development)** 75 AAT
NCV210SQT2G * 200 VAP
NCV211SQT2G * (In Development)** 500 VAM
NCV212SQT2G * (In Development)** 1000 VAN
NCV213SQT2G * (In Development)** 50 VAQ
NCV214SQT2G * (In Development)** 100 VAR
NCV215SQT2G * (In Development)** 75 VAT
NCS210MUTAG (In Development)** 200 TBD
UQFN10
(Pb−Free)
3000 / Tape and Reel
NCS211MUTAG (In Development)** 500 TBD
NCS212MUTAG (In Development)** 1000 TBD
NCS213MUTAG (In Development)** 50 TBD
NCS214MUTAG (In Development)** 100 TBD
NCS215MUTAG (In Development)** 75 TBD
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
** Contact local sales office for availability.
NCS210, NCS211, NCS212, NCS213, NCS214, NCS215
www.onsemi.com
5
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU-
SIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY AND DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDI-
TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OF THE FOOT.
Cddd
M
123
A1
A
c
654
E
b
6X
DIM MIN NOM MAX
MILLIMETERS
A −− −− 1.10
A1 0.00 −− 0.10
ddd
b 0.15 0.20 0.25
C 0.08 0.15 0.22
D 1.80 2.00 2.20
−− −− 0.043
0.000 −− 0.004
0.006 0.008 0.010
0.003 0.006 0.009
0.070 0.078 0.086
MIN NOM MAX
INCHES
0.10 0.004
E1 1.15 1.25 1.35
e 0.65 BSC
L 0.26 0.36 0.46
2.00 2.10 2.20
0.045 0.049 0.053
0.026 BSC
0.010 0.014 0.018
0.078 0.082 0.086
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.65
0.66
6X
DIMENSIONS: MILLIMETERS
0.30
PITCH
2.50
6X
RECOMMENDED
TOP VIEW
SIDE VIEW END VIEW
bbb
H
B
SEATING
PLANE
DETAIL A
E
A2 0.70 0.90 1.00 0.027 0.035 0.039
L2 0.15 BSC 0.006 BSC
aaa 0.15 0.006
bbb 0.30 0.012
ccc 0.10 0.004
A-B D
aaa C
2X 3 TIPS
D
E1
D
e
A
2X
aaa H D
2X
D
L
PLANE
DETAIL A
H
GAGE
L2
C
ccc
C
A2
6X
NCS210, NCS211, NCS212, NCS213, NCS214, NCS215
www.onsemi.com
6
PACKAGE DIMENSIONS
UQFN10 1.4x1.8, 0.4P
CASE 488AT
ISSUE A
A
b
A1
0.05
C
SEATING
PLANE
NOTE 3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
DIM MIN MAX
MILLIMETERS
A
1.40 BSC
A1
0.40 BSC
0.45 0.60
b
D
0.30 0.50
E
e
L
L1
0.00 0.05
PIN 1 REFERENCE
D A
E
B
0.10 C
2X
0.10 C
2X
0.05 C
C
L3
10
1
3
5
6
0.05 C
0.10
CAB
10 X
e
e/2
L9 X
0.00 0.15
1.80 BSC
0.15 0.25
MOUNTING FOOTPRINT
10 X
PITCH
1
9 X
SCALE 20:1
0.663
0.0261
0.200
0.0079
0.400
0.0157
0.225
0.0089
2.100
0.0827
1.700
0.0669
0.563
0.0221
ǒ
mm
inches
Ǔ
10X
L1
DETAIL A
Bottom View
(Optional)
A1
A3
DETAIL B
Side View
(Optional)
EDGE OF PACKAGE
MOLD CMPD
EXPOSED Cu
L3
0.40 0.60
0.127 REFA3
TOP VIEW
SIDE VIEW
BOTTOM VIEW
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NCS214SQT2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Current Sense Amplifiers CURRENT SENSE AMP G=
Lifecycle:
New from this manufacturer.
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