4
HCPL-814-300E
Solder Reow Temperature Prole
1) One-time soldering reow is recommended within
the condition of temperature and time prole shown
at right.
2) When using another soldering method such as infrared
ray lamp, the temperature may rise partially in the mold
of the device. Keep the temperature on the package of
the device within the condition of (1) above.
30 seconds
60 ~ 150 sec 90 sec 60 sec
60 sec
25°C
150°C
200°C
250°C
260°C (Peak Temperature)
217°C
Time (sec)
Temperature
(
°
C)
Absolute Maximum Ratings
Parameters Symbol Min. Max. Units
Storage Temperature T
S
–55 125 ˚C
Ambient Operating Temperature T
A
–30 100 ˚C
Lead Solder Temperature for 10s T
sol
260 ˚C
(1.6 mm below seating plane)
Average Forward Current I
F
±50 mA
Input Power Dissipation P
I
70 mW
Collector Current I
C
50 mA
Collector-Emitter Voltage V
CEO
35 V
Emitter-Collector Voltage V
ECO
6 V
Collector Power Dissipation P
C
150 mW
Total Power Dissipation P
tot
200 mW
Isolation Voltage V
iso
5000 V
rms
(AC for 1 minute, R.H. = 40 ~ 60%)
[1]
6.5 ± 0.5
(0.256)
DIMENSIONS IN MILLIMETERS AND (INCHES)
4.6 ± 0.5
(0.181)
2.54 ± 0.25
(0.1)
3.5 ± 0.5
(0.138)
7.62 ± 0.3
(0.3)
0.26
(0.010)
10.16 ± 0.3
(0.4)
1.2 ± 0.1
(0.047)
0.35 ± 0.25
(0.014)
1.0 ± 0.25
(0.039)
A 814
Y W W
DATE CODE
RANK
LEAD FREE
ANODE
Note: Non-halide ux should be used.