© Semiconductor Components Industries, LLC, 2012
April, 2017 − Rev. 4
1 Publication Order Number:
MBRS3201T3/D
MBRS3201T3G,
NRVBS3201T3G
200V, 3A Schottky
Fast Soft-Recovery
Power Rectifier
SMC Power Surface Mount Package
Features
• Lower Forward Voltage than any Ultrafast Rectifier:
V
F
< 0.59 V at 150°C
• Fast Switching Speed: Reverse Recovery Time (t
RR
) < 35 ns
• Soft Recovery Characteristics: Softness Factor (t
b
/t
a
) ≥ 1
• Highly Stable Over Temperature
• NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable*
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Benefits
• Significantly Reduced EMI
• Eliminates the Need of Snubber Circuits
• Low Switching and Heat Losses
• Improved Thermal Management
Applications
• Engine and Convenience Control Systems
• Motor Controls
• Battery Chargers and Switching Power Supplies
Mechanical Characteristics
• Small Compact Surface Mount Package with J-Bend Leads
• Rectangular Package for Automated Handling
• Weight: 217 mg (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• ESD Ratings:
♦ Machine Model = A
♦ Human Body Model = 1C
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Maximum for 10 Seconds
• Polarity: Notch in Plastic Body Indicates Cathode Lead
www.onsemi.com
Device Package Shipping
†
ORDERING INFORMATION
SCHOTTKY RECTIFIER
3 AMPS, 200 VOLTS
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
MBRS3201T3G SMC 2−Lead
(Pb−Free)
2500 /
Tape & Reel
B321 = Specific Device Code
A = Assembly Location**
Y = Year
WW = Work Week
G = Pb−Free Package
MARKING DIAGRAM
(Note: Microdot may be in either location)
NRVBS3201T3G* 2500 /
Tape & Reel
SMC 2−LEAD
CASE 403AC
AYWW
B321G
G
SMC 2−Lead
(Pb−Free)
** The Assembly Location code (A) is front side
optional. In cases where the Assembly Location i
stamped in the package, the front side assembly
code may be blank.