249
LC Series
Corcom Product Guide
Signal Line Products
LC Series
Filtered Modular Jacks with Enhanced Performance
6
Dimensions are in inches and millimeters unless otherwise specified. Values in italics
are metric equivalents. Dimensions are shown for reference purposes only.
Specifications subject to change.
Catalog: 1654001
Issue Date: 06.2011
For email, phone or live chat, please go to
te.com/help
corcom.com
Specifications
• Chip capacitors provide enhanced filtering
performance on each line
• Available with block or sleeve inductance
• Available with board grounded shield or
spring fingered panel ground interface
Available Part Numbers
UL Recognized
CSA Certified
RJ11-2LC1-S RJ11-6LC2-S
RJ11-2LC1-B RJ11-6LC2-B
RJ11-2LC2-S RJ45-6LC1-S
RJ11-2LC2-B RJ45-6LC1-B
RJ11-4LC1-S RJ45-6LC2-S
RJ11-4LC1-B RJ45-6LC2-B
RJ11-4LC2-S RJ45-8LC1-S
RJ11-4LC2-B RJ45-8LC1-B
RJ11-6LC1-S RJ45-8LC2-S
RJ11-6LC1-B RJ45-8LC2-B
Typical Insertion Loss
Performance Data
Model dimensions and PC board layout on pages 255-259
Shield 2
RJ11
Shield 1
RJ11
Shield 2
RJ45
Shield 1
RJ45
Contacts:
Material: Phosphor Bronze
Plating: 50 microinches gold
Barrier underplating: 100 microinches nickel
Resistance:
Initial: 20 m max.
After 500 mating cycles: 30 m max.
Capacitors:
Type: Monolithic ceramic chip
Standard Value: 820 pF
Standard Tolerance: ± 20%
Ferrites:
Type: High resistivity, nickel zinc ceramic
Sleeve
s: Single-aperture cylinders
Block: Multi-aperture rectangular prism
Shield Material: Tin-plated copper alloy
Housing Material: Glass-filled polyester (UL94V-0)
Dielectric Withstanding Voltage:
Line to Line and Line to Ground: 1000 VAC for
60 seconds
Printed Circuit Board Retention:
Before soldering: 1 lb. minimum
After soldering: 20 lb. minimum