SQD40131EL_GE3

SQD40131EL
www.vishay.com
Vishay Siliconix
S17-1302-Rev. A, 21-Aug-17
1
Document Number: 76864
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Automotive P-Channel 40 V (D-S) 175 °C MOSFET
FEATURES
TrenchFET
®
power MOSFET
Package with low thermal resistance
100 % R
g
and UIS tested
AEC-Q101 qualified
Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
Notes
a. Package limited
b. Pulse test; pulse width 300 μs, duty cycle 2 %
c. When mounted on 1" square PCB (FR4 material)
PRODUCT SUMMARY
V
DS
(V) -40
R
DS(on)
() at V
GS
= -10 V 0.0115
R
DS(on)
() at V
GS
= -4.5 V 0.0150
I
D
(A) -50
Configuration Single
Package TO-252
TO-252
Top View
TO
G
D
S
Drain connected to tab
S
G
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T
C
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-source voltage V
DS
-40
V
Gate-source voltage V
GS
± 20
Continuous drain current
T
C
= 25 °C
a
I
D
-50
A
T
C
= 125 °C -31
Continuous source current (diode conduction)
a
I
S
-50
Pulsed drain current
b
I
DM
-180
Single pulse avalanche current
L = 0.1 mH
I
AS
-27
Single pulse avalanche energy E
AS
36.4 mJ
Maximum power dissipation
b
T
C
= 25 °C
P
D
62
W
T
C
= 125 °C 20
Operating junction and storage temperature range T
J
, T
stg
-55 to +175 °C
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL LIMIT UNIT
Junction-to-ambient PCB mount
c
R
thJA
50
°C/W
Junction-to-case (drain) R
thJC
2.4
SQD40131EL
www.vishay.com
Vishay Siliconix
S17-1302-Rev. A, 21-Aug-17
2
Document Number: 76864
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes
a. Pulse test; pulse width 300 μs, duty cycle 2 %
b. Guaranteed by design, not subject to production testing
c. Independent of operating temperature
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS (T
C
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-source breakdown voltage V
DS
V
GS
= 0 V, I
D
= -250 μA -40 - -
V
Gate-source threshold voltage V
GS(th)
V
DS
= V
GS
, I
D
= -250 μA -1.5 -2 -2.5
Gate-source leakage I
GSS
V
DS
= 0 V, V
GS
= ± 20 V - - ± 100 nA
Zero gate voltage drain current I
DSS
V
GS
= 0 V V
DS
= -40 V - - -1
μA V
GS
= 0 V V
DS
= -40 V, T
J
= 125 °C - - -50
V
GS
= 0 V V
DS
= -40 V, T
J
= 175 °C - - -250
On-state drain current
a
I
D(on)
V
GS
= -10 V V
DS
5 V -30 - - A
Drain-source on-state resistance
a
R
DS(on)
V
GS
= -10 V I
D
= -30 A - 0.0095 0.0115
V
GS
= -10 V I
D
= -30 A, T
J
= 125 °C - - 0.0171
V
GS
= -10 V I
D
= -30 A, T
J
= 175 °C - - 0.0203
V
GS
= -4.5 V I
D
= -25 A - 0.0121 0.0150
Forward transconductance
b
g
fs
V
DS
= -15 V, I
D
= -30 A - 71 - S
Dynamic
b
Input capacitance C
iss
V
GS
= 0 V V
DS
= -25 V, f = 1 MHz
- 4872 6600
pF Output capacitance C
oss
- 344 500
Reverse transfer capacitance C
rss
- 316 450
Total gate charge
c
Q
g
V
GS
= -10 V V
DS
= -20 V, I
D
= -30 A
-76115
nC Gate-source charge
c
Q
gs
-11.5-
Gate-drain charge
c
Q
gd
-13.5-
Gate resistance R
g
f = 1 MHz 2 4 6
Turn-on delay time
c
t
d(on)
V
DD
= -20 V, R
L
= 0.7
I
D
-30 A, V
GEN
= -10 V, R
g
= 1
-1320
ns
Rise time
c
t
r
-715
Turn-off delay time
c
t
d(off)
-66100
Fall time
c
t
f
-2845
Source-Drain Diode Ratings and Characteristics
b
Pulsed current
a
I
SM
---180A
Forward voltage V
SD
I
F
= -30 A, V
GS
= 0 V - -0.9 -1.5 V
Body diode reverse recovery time t
rr
I
F
= -30 A, di/dt = 100 A/μs
-4390ns
Body diode reverse recovery charge Q
rr
-45100nC
Reverse recovery fall time t
a
-26-
ns
Reverse recovery rise time t
b
-17-
Body diode peak reverse recovery current I
RM(REC)
--2.8- A
SQD40131EL
www.vishay.com
Vishay Siliconix
S17-1302-Rev. A, 21-Aug-17
3
Document Number: 76864
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TYPICAL CHARACTERISTICS (T
A
= 25 °C, unless otherwise noted)
Output Characteristics
On-Resistance vs. Drain Current
Transconductance
Transfer Characteristics
Capacitance
Gate Charge
10
100
1000
10000
0
40
80
120
160
200
0246810
Axis Title
1st line
2nd line
2nd line
I
D
- Drain Current (A)
V
DS
- Drain-to-Source Voltage (V)
2nd line
V
GS
= 10 V thru 5 V
V
GS
= 3V
V
GS
= 4 V
0.000
0.006
0.012
0.018
0.024
0.030
0 1632486480
R
DS(on)
- On-Resistance (Ω)
I
D
- Drain Current (A)
2nd line
V
GS
= 10 V
V
GS
=4.5 V
10
100
1000
10000
0
20
40
60
80
100
0 1530456075
Axis Title
1st line
2nd line
2nd line
g
fs
- Transconductance (S)
I
D
- Drain Current (A)
2nd line
T
C
= 25 °C
T
C
=-55 °C
T
C
= 125 °C
10
100
1000
10000
0
20
40
60
80
100
0246810
Axis Title
1st line
2nd line
2nd line
I
D
- Drain Current (A)
V
GS
- Gate-to-Source Voltage (V)
2nd line
T
C
= 25 °C
T
C
=-55 °C
T
C
= 125 °C
10
100
1000
10000
0
1400
2800
4200
5600
7000
0 8 16 24 32 40
Axis Title
1st line
2nd line
2nd line
C - Capacitance (pF)
V
DS
- Drain-to-Source Voltage (V)
2nd line
C
rss
C
oss
C
iss
10
100
1000
10000
0
2
4
6
8
10
0 20406080100
Axis Title
1st line
2nd line
2nd line
V
GS
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
2nd line
I
D
= 30 A
V
DS
= 20 V

SQD40131EL_GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET -40V Vds -/+20V Vgs AEC-Q101 Qualified
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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