Applications Information
A properly designed PCB is essential to any RF micro-
wave circuit. Use controlled-impedance lines on all
high-frequency inputs and outputs. Bypass V
CC
with
decoupling capacitors located close to the device. For
long V
CC
lines, it may be necessary to add decoupling
capacitors. Locate these additional capacitors further
away from the device package. Proper grounding of
the GND pin is essential. If the PCB uses a topside RF
ground, connect it directly to the GND pin. For a board
where the ground is not on the component layer, con-
nect the GND pin to the board with multiple vias close
to the package.
Refer to www.maximintegrated.com for the MAX2686
EV kit schematic, Gerber data, PADS layout file, and
BOM information.
Table 4. MAX2688 Typical Noise Parameters (V
CC
= 2.85V, T
A
= +25°C)
MAX2686/MAX2688 GPS/GNSS Low-Noise Ampliers
www.maximintegrated.com
Maxim Integrated
│
7
Chip Information
PROCESS: SiGe BiCMOS
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
FREQUENCY (MHz) FMIN (dB)
| G
OPT
| | G
OPT
| ANGLE
R
N
(Ω)
1550 0.73 0.42 59.0 8.34
1560 0.74 0.42 59.4 8.31
1570 0.74 0.42 59.7 8.29
1575 0.74 0.42 59.9 8.28
1580 0.74 0.42 60.1 8.27
1590 0.74 0.41 60.5 8.25
1600 0.74 0.41 60.8 8.22
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
4 WLP W40A0+1 21-0480 —
