PROTECTION PRODUCTS
1
www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS - RailClamp
®®
®®
®
RClamp3324T
Low Voltage RailClamp
®
4-Line ESD Protection
Description
Features
Circuit Diagram Pin Configuration (Top View)
Revision 9/24/2014
Applications
Mechanical Characteristics
ESD protection for high-speed data lines to
IEC 61000-4-2 (ESD) ±30kV (air), ±25kV (contact)
IEC 61000-4-5 (Lightning) 5A (8/20μs)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Flow-Through design
Protects four high-speed lines
Low capacitance: 0.40pF typical (I/O to ground)
Low ESD clamping voltage
Extremely low dynamic resistance: 0.35 Ohms (Typ)
Solid-state silicon-avalanche technology
USB 3.0
HDMI 1.3/1.4
10GBase-T Ethernet
V-By-One
Display Port
MHL
LVDS Interfaces
eSATA Interfaces
Pin 1 Pin 2 Pin 3 Pin 4
5, 6
SLP1710P4T 6L package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 1.7 x 1.0 x 0.40 mm
Lead Finish: NiPdAu
Molding compound flammability rating: UL 94V-0
Marking : Marking code + date code
Packaging : Tape and Reel
1
I/O 1
I/O 2
I/O 3
I/O 4
GND
GND
The RClamp
®
3324T provides ESD protection for
USB3.0, HDMI1.3/1.4, and other high-speed ports. It
features a high maximum ESD withstand voltage of
±25kV contact and ±30kV air discharge per IEC
61000-4-2. RClamp3324T is designed to minimize
both the ESD peak clamping and the TLP clamping.
Peak ESD clamping voltage is extremely low and
approximately the same at each pin. The dynamic
resistance is among the industry’s lowest at 0.35
Ohms (typical). Typical capacitance on each line to
ground is approximately 0.40pF. This allows the
RClamp3324T to be used in applications operating in
excess of 5GHz without signal attenuation. These
devices are manufactured using Semtech’s proprietary
low voltage EPD technology for superior characteritics
at operating voltages up to 3.3 volts. Each device will
protect up to four lines (two high-speed pairs).
The RClamp3324T is in a 6-pin SLP1710P4T package. It
measures 1.7 x 1.0mm with a nominal height of 0.40mm.
The leads have a nominal pin-to-pin pitch of 0.40mm.
The flow- through package design simplifies PCB layout
and maintains signal integrity on high-speed lines.
The combination of low peak ESD clamping, low dynamic
resistance, and innovative package design enables this
device provides the highest level of ESD protection for
applications such as USB 3.0, HDMI and V-By-One inter-
faces.
