LQP03HQ1N5C02D Datasheet LQP03HQ1N6C02D, LQP03HQ1N0C02D, LQP03HQ1N5C02D | P7-P9

Spec No.JELF243C-0021E-01 P.7/11

MURATA MFG.CO., LTD

Reference Only

10.5 Dimensions of Leader-tape, Trailer and Reel

There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.

(in mm)

10.6 Marking for reel

Customer part number, MURATA part number, Inspection number(∗1) ,

RoHS Marking (∗2),

Quantity etc ･･･

∗1) <Expression of Inspection No.>

□□ OOOO ×××

(1) (2) (3)

(1) Factory Code

(2) Date First digit : Year / Last digit of year

Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D

Third, Fourth digit : Day

(3) Serial No.

∗2) <Expression of RoHS Marking> ROHS – Y (△)

(1) (2)

(1)

RoHS regulation conformity parts.

(2) MURATA classification number

10.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number,

RoHS Marking (∗2) ,Quantity, etc ･･･

10.8 Specification of Outer Case

Outer Case Dimensions

(mm)

Standard Reel Quantity

in Outer Case (Reel)

W D H

186 186 93 5

∗ Above Outer Case size is typical. It depends on a quantity of an order.

11. ！ Caution

Limitation of Applications

Please contact us before using our products for the applications listed below which require especially

high reliability for the prevention of defects which might directly cause damage to the third party's life,

body or property.

(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)

(2) Aerospace equipment

(7) Traffic signal equipment

(3) Undersea equipment

(8) Disaster prevention / crime prevention equipment

(4) Power plant control equipment (9) Data-processing equipment

(5) Medical equipment (10) Applications of similar complexity and /or reliability

requirements to the applications listed in the above

12. Notice

Products can only be soldered with reflow.

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

Empty tape

190 min.

Leader

Trailer

2.0±0.5

13.0±0.2

21.0±0.8

180

9.0

13.0±1.4

-3

Direction of feed

210 min.

160 min.

Cover tape

-0

Label

Spec No.JELF243C-0021E-01 P.8/11

MURATA MFG.CO., LTD

Reference Only

12.1 Land pattern designing

a 0.3

b 0.9

c 0.25~0.30

(in mm)

12.2 Flux, Solder

・ Use rosin-based flux.

Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

Don’t use water-soluble flux.

・ Use Sn-3.0Ag-0.5Cu solder.

・ Standard thickness of solder paste : 100μm

12.3 Reflow soldering conditions

・ Pre-heating should be in such a way that the temperature difference between solder and

product surface is limited to 150°C max. Cooling into solvent after soldering also should be

in such a way that the temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of

products quality.

・ Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting

in the deterioration of product quality.

・Reflow soldering profile

Standard Profile Limit Profile

Pre-heating 150°C～180°C 、90s±30s

Heating above 220°C､30s～60s above 230°C､60s max.

Peak temperature 245°C±3°C 260°C,10s

Cycle of reflow 2 times 2 times

12.4 Reworking with soldering iron

The following conditions must be strictly followed when using a soldering iron.

Pre-heating 150°C,1 min

Tip temperature 350°C max.

Soldering iron output 80W max.

Tip diameter φ3mm max.

Soldering time 3(+1,-0)s

Time 2 times

Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the

crack on the products due to the thermal shock.

Limit Profile

Standard Profile

90s±30s

230℃

260℃

245℃±3℃

220℃

30s～60s

60s max.

180

150

Temp.

(s)

(℃)

Time.

Solder resist

ａ

ｂ

Chip Coil

Land

Spec No.JELF243C-0021E-01 P.9/11

MURATA MFG.CO., LTD

Reference Only

12.5 Solder Volume

･ Solder shall be used not to be exceeded the upper limits as shown below.

1/3T≦t≦1/2T

T : thickness of product

Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

12.6 Attention regarding P.C.B. bending

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to

warping the board.

［Products direction］

Products shall be located in the sideways

direction (Length:ａ＜b) to the mechanical

stress.

(2) Products location on P.C.B. separation

Products (A,B,C,D) shall be located carefully

so that products are not subject to the

mechanical stress due to warping the board.

Because they may be subjected the mechanical

stress in order of A＞C＞B ≅ D.

12.7 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance

phenomenon at the mounted products and P.C.B.

Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max.

(3) Cleaner

1. Alcohol type cleaner

Isopropyl alcohol (IPA)

2. Aqueous agent

PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized

water in order to remove the cleaner.

(5) Other cleaning Please contact us.

12.8 Resin coating

When products are coated with resin, please contact us in advance.

12.9 Handling of a substrate

(1)There is a possibility of chip cracking caused by PCBexpansion/contraction with heat, because stress

on a chip is different depending on PCB material and structure.

When the thermal expansion coefficient greatly differs between the board used for mounting and the chip,

it will cause cracking of the chip due to the thermal expansion and contraction.

The chip is assumed to be mounted on the PCB of glass-epoxy material, and we don't test with other

PCB material which has different thermal expansion coefficient from Glass-epoxy.

When other PCB materials are considered, please be sure to evaluate by yourself.

Recommendable

Upper Limit

〈

Poor example

〉

〈

Good example

〉

Seam

Slit

Length:a

P1-P3 P4-P6 P7-P9 P10-P11

LQP03HQ1N5C02D

Mfr. #:

Buy LQP03HQ1N5C02D

Manufacturer:

Murata Electronics

Description:

Fixed Inductors

Lifecycle:

New from this manufacturer.

Delivery:

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LQP03HQ1N5C02D

LQP03HQ1N5C02D

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