17
ICL3224E, ICL3226E, ICL3244E
Shrink Small Outline Plastic Packages (SSOP)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.20mm (0.0078
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.13mm (0.005 inch) total in excess
of “B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
α
INDEX
AREA
E
D
N
123
-B-
0.25(0.010) C A
M
B
S
e
-A-
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
C
H
0.25(0.010) B
M
M
L
0.25
0.010
GAUGE
PLANE
A2
M20.209 (JEDEC MO-150-AE ISSUE B)
20 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.068 0.078 1.73 1.99
A1 0.002 0.008’ 0.05 0.21
A2 0.066 0.070’ 1.68 1.78
B 0.010’ 0.015 0.25 0.38 9
C 0.004 0.008 0.09 0.20’
D 0.278 0.289 7.07 7.33 3
E 0.205 0.212 5.20’ 5.38 4
e 0.026 BSC 0.65 BSC
H 0.301 0.311 7.65 7.90’
L 0.025 0.037 0.63 0.95 6
N20 207
α
0 deg. 8 deg. 0 deg. 8 deg.
Rev. 3 11/02
