DAC10GP Datasheet DAC10GPZ, DAC10GSZ, DAC10FX | P4-P6

–3–REV. D

DAC10

WAFER TEST LIMITS

DAC10N

Parameter Symbol Conditions Limit Units

RESOLUTION 10 Bits min

MONOTONICITY 10 Bits min

NONLINEARITY NL ±0.5 LSB max

OUTPUT VOLTAGE COMPLIANCE V

OC

True 1 LSB +10 V max

–5 V min

OUTPUT CURRENT RANGE I

FS

±3.996 mA ±18 µA max

ZERO-SCALE CURRENT I

ZS

All Bits OFF 0.5 µA max

LOGIC INPUT “1” V

IH

I

IN

= 100 nA 2 V min

LOGIC INPUT “0” V

IL

V

LC

@ Ground 0.8 V max

I

IN

= –100 µA

POSITIVE SUPPLY CURRENT I+ V+ = 15 V 4 mA max

NEGATIVE SUPPLY CURRENT I– V+ = –15 V –15 mA max

NOTE: Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not

guaranteed for standard produce dice.

TYPICAL ELECTRICAL CHARACTERISTICS

DAC10F

Parameter Symbol Conditions Typ Units

SETTLING TIME t

S

To ±1/2 LSB When Output Is Switched from 0 to FS 85 ns

GAIN TEMPERATURE

COEFFICIENT (TC) V

REF

Tempco Excluded ±10 ppm FS/°C

OUTPUT CAPACITANCE 18 pF

OUTPUT RESISTANCE 10 MΩ

(@ V

S

= 615 V, I

REF

= 2 mA, T

A

= +258C, unless otherwise noted. Output characteristics refer to both

I

OUT

and I

OUT

).

(@ V

S

= 615 V, I

REF

= 2 mA, unless otherwise noted. Output characteristics

refer to both I

OUT

and I

OUT

).

DICE CHARACTERISTICS

DIE SIZE 0.091 3 0.087 inch, 7,917 sq. mils

(2.311 3 2.210 mm, 5.107 sq. mm)

DAC10

–4–

REV. D

ABSOLUTE MAXIMUM RATINGS

1

Operating Temperature

DAC10FX, GX, GS, GP . . . . . . . . . . . . . . . . 0°C to +70°C

Junction Temperature (T

J

) . . . . . . . . . . . . . –65°C to +150°C

Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +150°C

Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . +300°C

V+ Supply to V– Supply . . . . . . . . . . . . . . . . . . . . . . . . . 36 V

Logic Inputs . . . . . . . . . . . . . . . . . . . . . . V– to V– plus 36 V

V

LC

␣ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V– to V+

Analog Current Outputs . . . . . . . . . . . . . . . . +18 V to –18 V

Reference Inputs (V

16

to V

17

) . . . . . . . . . . . . . . . . . V– to V+

Reference Input Differential Voltage (V

16

to V

17

) . . . . ±18 V

Reference Input Current (I

16

) . . . . . . . . . . . . . . . . . . 2.5 mA

Package Type u

JA

2

u

JC

Units

18-Lead Hermetic DIP (X) 48 15 °C/W

18-Lead SOIC (S) 89 28 °C/W

18-Lead Plastic DIP (P) 74 33 °C/W

NOTES

1

Absolute maximum ratings apply to both DICE and packaged parts, unless

otherwise noted.

2

θ

JA

is specified for worst case mounting conditions, i.e., θ

JA

is specified for device

in socket for Cerdip packages.

ORDERING GUIDE

INL Temperature Package Package

Model (LSB) Range Description Options

DAC10FX 0.5 0°C to +70°C Cerdip Q-18

DAC10GX 1 0°C to +70°C Cerdip Q-18

DAC10GS 1 0°C to +70°C SOIC R-18

DAC10GP 1 0°C to +70°C Plastic DIP N-18

PIN CONNECTIONS

18-Lead Hermetic DIP

18-Lead Plastic DIP

18-Lead SOIC

TOP VIEW

(Not to Scale)

18

17

16

15

14

13

12

11

10

1

2

3

4

5

6

7

8

9

DAC10

B5

B4

V

LC

I

O

V–

I

O

B3

B2

(MSB) B1

B6

B7

COMP

V

REF

(–)

V

REF

(+)

V+

B8

B9

B10 (LSB)

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

BASIC CONNECTIONS

0mA

1.0mA

2.0mA

I

OUT

I

OUT

(0000000000) (11111111111)

I

REF

= 2mA

Figure 1. True and Complementary

Output Operations

V+, POSITIVE POWER SUPPLY – V

DC

POWER SUPPLY CURRENT – mA

10

3

0

02 20

4681012141618

9

4

2

1

6

5

8

7

ALL BITS "HIGH" OR "LOW"

I–

I+

Figure 4. Power Supply Current

vs. V+

0.1mF

C

318

V+

0.01mF

15

COMP

B

1

5 6

B

2

B

3

7 8

B

4

9

B

5

10

B

6

11

B

7

12

B

8

13

B

9

14

B

10

V

LC

1

I

FR

=

+V

REF

R

REF

3

1023

1024

2

3

I

O

+ I

O

= I

FR

FOR ALL

LOGIC STATES

+V

REF

R

REF

(R16)

I

REF

R17

16

MSB

LSB

FOR FIXED REFERENCE,

TTL OPERATION,

TYPICAL VALUES ARE:

V

REF

= +10.000V

R

REF

= 5.000kV

R15 = R

REF

C

= 0.01mF

V

LC

= 0V (GROUND)

I

O

I

O

4

2

17

DAC10

V–

Figure 7. Basic Positive Reference Operation

Typical Performance Characteristics–DAC10

–5–

REV. D

WARNING!

ESD SENSITIVE DEVICE

V– = –15V, V– = –10V

T

A

= T

MIN

TO T

MAX

ALL BITS ON

OUTPUT VOLTAGE – Volts

OUTPUT CURRENT – mA

8.0

0

–14 –10 18–6 –2 2 6 10 14

7.2

4.8

4.0

2.4

0.8

6.4

5.6

3.2

1.6

I

REF

= 1mA

I

REF

= 2mA

I

REF

= 0.2mA

Figure 2. Output Current vs. Output

Voltage (Output Voltage Compliance)

POWER SUPPLY CURRENT – mA

10

3

0

0 –20

–4 –8 –12 –16

9

4

2

1

6

5

8

7

V–, NEGATIVE POWER SUPPLY – V

DC

BITS MAY BE HIGH OR LOW

I – WITH I

REF

= 2mA

I – WITH I

REF

= 1mA

I – WITH I

REF

= 0.2mA

I – WITH I

REF

= 0.2mA

Figure 5. Power Supply Current

vs. V–

TEMPERATURE – 8C

OUTPUT VOLTAGE – Volts

+28

–12

–50

FOR OTHER V– OR I

REF

SEE OUTPUT CURRENT

vs. OUTPUT VOLTAGE

CURVE

SHADED AREA INDICATES

PERMISSABLE OUTPUT

VOLTAGE RANGE

FOR V– = –15V

I

REF

# 2.0mA

0

+50 +100 +150

+24

+4

0

–4

–8

+20

+16

+8

+12

Figure 3. Output Voltage Compliance

vs. Temperature

TEMPERATURE – 8C

POWER SUPPLY CURRENT – mA

10

0

–50

0 +50 +100 +150

9

4

3

2

1

8

7

5

6

ALL BITS MAY BE "HIGH" OR "LOW"

V+ = +15V

I+

I–

I

REF

= 2.0mA

V– = –15V

Figure 6. Power Supply Current vs.

Temperature

DAC10

16

17

16

17

V

IN

V

IN

I

IN

R

REF

R17

(OPTIONAL)

R

IN

I

REF

+V

REF

R

REF

R

REF

R17

+V

REF

I

REF

PEAK NEGATIVE SWING OF I

IN

+V

REF

MUST BE ABOVE PEAK POSITIVE SWING OF V

IN

HIGH INPUT

IMPEDANCE

Figure 8. Accommodating Bipolar References

DAC10GP

DAC10GP

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