For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
11
11 - 70
LINEAR & POWER AMPLIFIERS - SMT
Outline Drawing
Absolute Maximum Ratings
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
LAND PATTERN.
Collector Bias Voltage (Vcc) +5Vdc
Control Voltage (Vpd) +3.5 Vdc
RF Input Power (RFIN)(Vs = Vpd = +3.0 Vdc) +13 dBm
Junction Temperature 150 °C
Continuous Pdiss (T = 85 °C)
(derate 17 mW/°C above 85 °C)
1.105 W
Thermal Resistance
(junction to ground paddle)
59 °C/W
Storage Temperature -65 to +150 °C
Operating Temperature -40 to +85 °C
Part Number Package Body Material Lead Finish MSL Rating Package Marking
[3]
HMC415LP3 Low Stress Injection Molded Plastic Sn/Pb Solder
MSL1
[1]
415
XXXX
HMC415LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
MSL1
[2]
415
XXXX
[1] Max peak re ow temperature of 235 °C
[2] Max peak re ow temperature of 260 °C
[3] 4-Digit lot number XXXX
Package Information
HMC415LP3 / 415LP3E
GaAs InGaP HBT MMIC
POWER AMPLIFIER, 4.9 - 5.9 GHz
v03.0605
ELECTROSTATIC SENSITIVE DEVICE
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