DS23022 Rev. 5 - 2 1 of 3 SB120-SB160
www.diodes.com
ã Diodes Incorporated
SB120 - SB160
1.0A SCHOTTKY BARRIER RECTIFIER
Features
A
A
B
C
D
DO-41 Plastic
Dim Min Max
A
25.40 ¾
B
4.06 5.21
C
0.71 0.864
D
2.00 2.72
All Dimensions in mm
Maximum Ratings and Electrical Characteristics
@ T
A
= 25°C unless otherwise specified
·
Schottky Barrier Chip
·
Guard Ring Die Construction for Transient Protection
·
Low Power Loss, High Efficiency
·
High Surge Capability
·
High Current Capability and Low Forward Voltage Drop
·
Surge Overload Rating to 40A Peak
·
For Use in Low Voltage, High Frequency Inverters, Free
Wheeling, and Polarity Protection Applications
·
Lead Free Finish, RoHS Compliant (Note 3)
Mechanical Data
·
Case: DO-41 Plastic
·
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
·
Moisture Sensitivity: Level 1 per J-STD-020C
·
Terminals: Finish - Bright Tin. Plated Leads Solderable per
MIL-STD-202, Method 208
·
Polarity: Cathode Band
·
Mounting Position: Any
·
Ordering Information: See Last Page
· Marking: Type Number
·
Weight: 0.3 grams (approximate)
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic Symbol SB120 SB130 SB140 SB150 SB160 Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
20 30 40 50 60 V
RMS Reverse Voltage
V
R(RMS)
14 21 28 35 42 V
Average Rectified Output Current
(Note 1) (See Figure 1)
I
O
1.0 A
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
(JEDEC Method)
I
FSM
40 A
Forward Voltage (Note 2) @ I
F
= 1.0A
V
FM
0.50 0.70 V
Peak Reverse Current @ T
A
= 25°C
at Rated DC Blocking Voltage (Note 2) @ T
A
= 100°C
I
RM
0.5
mA
10 5.0
Typical Thermal Resistance Junction to Lead (Note 1)
R
qJL
15 °C/W
Typical Thermal Resistance Junction to Ambient
R
qJA
50
°C/W
Operating Temperature Range
T
j
-65 to +125 -65 to +150
°C
Storage Temperature Range
T
STG
-65 to +150
Notes: 1. Measured at ambient temperature at a distance of 9.5mm from the case.
2. Short duration test pulse used to minimize self-heating effect.
3. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see
EU Directive Annex Notes 5 and 7.
