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PS2503-1-M-A

P1-P3P4-P6P7-P9P10-P12
Data Sheet PN10227EJ04V0DS
7
PS2503-1,PS2503L-1
Normalized to 1.0
at T
A
= 25°C,
I
F
= 1 mA, V
CE
= 5 V
Forward Current I
F
(mA)
Ambient Temperature T
A
(°C)
Ambient Temperature T
A
(°C)
Frequency f (Hz)
Normalized Current Transfer Ratio CTR
Current Transfer Ratio CTR (%)
Normalized Gain G
V
Load Resistance R
L
(Ω)
Switching Time t ( s)
µ
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
SWITCHING TIME vs.
AMBIENT TEMPERATURE
SWITCHING TIME vs.
LOAD RESISTANCE
FREQUENCY RESPONSE
Switching Time t ( s)
µ
Time (Hr)
CTR (Relative Value)
LONG TERM CTR DEGRADATION
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
10050 75
25
0
–30
400
300
200
100
0
0.3
0.5
1
5
10 50 100
500
100
50
10
5
1
100
75
50
25
0
–25
–50
t
r
CTR = 290%,
V
CC
= 5 V,
I
F
= 1 mA,
R
L
= 10 kΩ
t
s
t
f
t
d
50
10
5
1
0.1
0.5
100 k50 k10 k5 k1 k
500
100
I
F
= 1 mA, V
CC
= 5 V,
CTR = 209%,
t
r
t
d
t
f
t
s
I
F
V
CC
V
O
R
L
50 Ω
0
–3.0
–6.0
–9.0
–12.0
–15.0
100
1 k
10 k
100 k
1 M
V
CC
= 5 V,
CTR = 209%
R
L
= 5.6 kΩ
1 kΩ
300 Ω
1.2
1.0
0.8
0.6
0.4
0.2
0
10
2
10
3
10
4
10
5
I
F
= 5 mA
T
A
= 60°C
I
F
= 5 mA
T
A
= 25°C
Sample A
B
C
V
CE
= 5 V
Remark The graphs indicate nominal characteristics.
Data Sheet PN10227EJ04V0DS
8
PS2503-1,PS2503L-1
TAPING SPECIFICATIONS (UNIT : mm)
Tape Direction
Outline and Dimensions (Tape)
Outline and Dimensions (Reel)
PS2503L-1-F3
1.55±0.1
2.0±0.1
4.0±0.1
1.75±0.1
4.5 MAX.
4.0±0.1
0.4
5.3±0.1
8.0±0.1
7.5±0.1
16.0±0.3
10.3±0.1
1.5
+0.1
–0
φ
Packing: 2 000 pcs/reel
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
330±2.0
100±1.0
2.0±0.5
φ
φ
15.9 to 19.4
Outer edge of
flange
21.5±1.0
17.5±1.0
<R>
Data Sheet PN10227EJ04V0DS
9
PS2503-1,PS2503L-1
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature 260°C or below (package surface temperature)
• Time of peak reflow temperature 10 seconds or less
• Time of temperature higher than 220°C 60 seconds or less
• Time to preheat temperature from 120 to 180°C 120±30 s
• Number of reflows Three
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
120±30 s
(preheating)
220°C
180°C
Package Surface Temperature T (°C)
Time (s)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
to 60 s
260°C MAX.
120°C
(2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
• Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
• Number of times One (Allowed to be dipped in solder including plastic mold portion.)
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
• Peak temperature (lead part temperature) 350°C or below
• Time (each pins) 3 seconds or less
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
P1-P3P4-P6P7-P9P10-P12

PS2503-1-M-A

Mfr. #:
Buy PS2503-1-M-A
Manufacturer:
CEL
Description:
Transistor Output Optocouplers SGL Tr LW Input Couplr MRank
Lifecycle:
New from this manufacturer.
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