(1.27 mm) .050"
SEAF SERIES
SEAF–30–05.0–S–08–2–A–K–TR
SEAF–20–05.0–S–10–2–A–K–TR
SEAF–30–05.0–S–08–2–A–LP–K–TR
Up to
500 pins
5, 8 and 10 row footprint
compatible with SamArray
®
.
Samples recommended.
Solder
charges
Low
insertion/
extraction
forces
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
Board Mates:
SEAM, SEAMP,
SEAR, SEAMI
Cable Mates:
SEAC
Standoffs:
JSO
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAF
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Operating Temp Range:
-55 °C to +125 °C
Current Rating
(7 mm stack height):
1.8 A per pin
(10 adjacent pins powered)
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Contact Resistance:
5.5 mW
Working Voltage:
240 VAC
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
DIFFERENTIAL
.050
HIGH-SPEED/HIGH-DENSITY OPEN-PIN-FIELD
LEAD
STYLE
A
–05.0
(5.05)
.199
–06.0
(6.05)
.238
–06.5
(6.55)
.258
–LP
SEAF A K TR
PLATING
OPTION
NO. OF
ROWS
LEAD
STYLE
– 04
=Four
Rows
– 05
=Five
Rows
– 06
=Six
Rows
– 08
=Eight
Rows
– 10
=Ten
Rows
–K
= Polyimide
film Pick &
Place Pad
(Not
available
with –10 and
–15 pins
with –LP
Latch post)
– LP
= Latch Post
(–LP required
for SEAC
mate only)
(Available with
–05.0 lead style
and –04, –06, –08
& –10 rows only)
Specify
LEAD
STYLE
from
chart
NO. PINS
PER ROW
–L
= 10 µ"
(0.25 µm)
Gold on
contact
area,
Matte Tin on
solder tail
–S
= 30 µ"
(0.76 µm)
Gold on
contact
area,
Matte Tin on
solder tail
OPTION
F-217
NO. OF
ROWS
B
–04
(5.66) .223
–05, –06
(8.20) .323
–08
(10.74) .423
–10
(13.28) .523
(1.15 mm)
.045"
NOMINAL
WIPE
SOLDER
TYPE
– 1
= Tin/Lead
Alloy
Solder Charge
– 2
= Lead-Free
Solder Charge
For complete scope of
recognitions see
www.samtec.com/quality
RECOGNITIONS
–10, –15, – 20,
– 30, –40, –50
(–10 only available
in 04 row)
(–15 only available
in 04 or 10 row with
–05.0 lead style)
ARRAY
PAIR
COUNT
40x8
80
40x6
60
30x10
75
30x8
60
30x6
45
20x10
50
20x8
40
20x5
25
ARRAY
PAIR
COUNT
50x10
125
50x8
100
40x10
100
No. of positions x
(1.27) .050 + (5.82) .229
No. of positions x
(1.27) .050 + (3.58) .141
A
(0.20)
.008
01
08
.050
(1.12) .044 DIA
(1.78)
.070
(15.49)
.610
B
(1.27)
.050
ALSO AVAILABLE
(MOQ Required)
• Polarization pin
Contact Samtec.
FILE NO. E111594
STANDARDS
PROTOCOLS
• PISMO 2
• VITA 47
• VITA 57.1
• 100 GbE
• Fibre Channel
• Rapid I/O
• PCI Express
®
• S ATA
• InfiniBand
™
MATED HEIGHTS
SEAM
LEAD
STYLE
SEAF LEAD STYLE
–05.0 –06.0 –06.5
–02.0
7 mm 8 mm 8.5 mm
–03.0
8 mm 9 mm 9.5 mm
–03.5
8.5 mm 9.5 mm 10 mm
–06.5
11.5 mm 12.5 mm 13 mm
–07.0
12 mm 13 mm 13.5 mm
–09.0
14 mm 15 mm 15.5 mm
–11.0
16 mm 17 mm 17.5 mm
EXTENDED LIFE
PRODUCT
10 YEAR MFG
WITH 30 µ" GOLD
HIGH MATING
CYCLES
SPECIFICATIONS
Gbps
HIGH-SPEED CHANNEL PERFORMANCE
SEAF/SEAM @ 10 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
Notes:
Patented
IPC-A-610F and
IPC J-STD-001F Class 3
solder joint.
Some sizes, styles and
options are non-standard,
non-returnable.
