MTFDDAK032SBD-1AH12ITYY Datasheet MTFDDAK064SBD-1AK12ITYY, MTFDDAK032SBD-1AH12ITYY, MTFDDAK128SBD-1AK12ITYY | P10-P12

Electrical Characteristics

Environmental conditions beyond those listed may cause permanent damage to the de-

vice. This is a stress rating only, and functional operation of the device at these or any

other conditions above those indicated in the operational sections of this specification

is not implied. Exposure to absolute maximum rating conditions for extended periods

may affect reliability.

Table 10: SATA Power Consumption

Capacity (GB)

Device Sleep

Typical Idle Average Active Average

Active Maximum

(128KB transfer) Unit

32 10 100 150 2300 mW

64 10 100 150 2400 mW

128 10 100 150 3600 mW

Notes:

1. Data taken at 25°C using a 6 Gb/s SATA interface.

2. Active average power measured while running MobileMark productivity suite.

3. DIPM (device-initiated power management) enabled. DIPM slumber supported.

4. Active maximum power is an average power measurement performed using Iometer

with 128KB sequential write transfers.

Table 11: Maximum Ratings

Parameter/Condition Symbol Min Max Unit Notes

Voltage input V5 4.5 5.5 V

Operating temperature T

–40 85 °C 1

Non-operating temperature –40 85 °C

Rate of temperature change – 20 °C/hour

Relative humidity (non-condensing) 5 95 %

Note:

1. Operating temperature is best measured by reading the SSD's on-board temperature

sensor, which is recorded in SMART attribute 194 (or 0xC2).

Table 12: Shock and Vibration

Parameter/Condition Specification

Non-operating shock 1500G/0.5ms (10x shocks per axis)

Non-operating vibration 7 – 2000Hz @ 20 Grms (30 minutes per axis)

Note:

1. Stress qualification tests are not intended for operational or continuous use. Exposure

to these conditions may affect reliability.

M500IT 2.5-Inch NAND Flash SLC SSD

Electrical Characteristics

CCMTD-731836775-10445

m500it_2_5_SLC_industrial_ssd.pdf - Rev. B 5/17 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Adaptive Thermal Monitoring

The device features adaptive thermal monitoring. While most host computers exhibit

operating environments that keep an SSD running in the range of 40°C to 45°C, adap-

tive thermal monitoring enables the SSD device to operate in a wide variety of environ-

ments by helping to prevent the host computer from running at excessive temperatures.

Adaptive thermal monitoring reduces total SSD power consumption by the device con-

troller, as well as the NAND media, by injecting time-based delays between internal

processing of media commands when the device temperature reaches 85 °C. The delay

times used are bound to the millisecond range, and are based on a proportional and dif-

ferential control equation of the general form shown here.

Figure 5: Adaptive Thermal Monitoring Control Equation

u(t) = Kp × T

(t) + Kd ×

The delay-control equation is tuned for a steady-state temperature target, which has

been designed as an optimum balance of hardware temperature tolerances and drive

performance. Steady-state temperature targets are hardware-configuration dependant,

and may range from 85 °C to 95 °C. Temperatures below the intended steady-state target

will not produce a proportional component to delay, but may produce a differential

component based on the current rate of temperature change according to the control

equation. When the feature is active, DRAM refresh rates are also adjusted to improve

data integrity and stability while operating outside of temperature specifications.

When the device temperature falls below 95 °C, normal operation will continue without

induced delays. If temperature continues to rise above the temperature target and ex-

ceeds a hardware-dependant critical threshold, the device will abort all commands at

101C or higher.

Device temperature values used by the adaptive thermal monitoring feature are based

on an internal temperature sensor located on the device PCB, and may differ from case

or package temperatures as measured by thermistor. Device temperature is accessible

through SMART attribute 194, though usage of the SMART feature is not necessary for

adaptive thermal monitoring functionality.

Adaptive thermal monitoring does not change the current negotiated speed of the SATA

bus, nor require or cause any new commands to be issued on the SATA bus. Rated-

throughput performance is not guaranteed at any point above the maximum specified

operating temperature.

M500IT 2.5-Inch NAND Flash SLC SSD

Adaptive Thermal Monitoring

CCMTD-731836775-10445

m500it_2_5_SLC_industrial_ssd.pdf - Rev. B 5/17 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

TCG/Opal Support

Table 13: TCG/Opal Support Parameters

Property Supported? Comments

TCG Storage Specifications

OPAL: TCG Storage Security SubSystem

Class

Specification 2.00 Revision 1.00, Feb 24, 2012

TCG Core Specification Specification 2.00 Revision 2.00, Nov 4, 2011

TCG Storage Interface Interactions Specifi-

cation

TCG Reference

Specification

Specification Version 1.02 Revision 1.00 30 Decem-

ber, 2011

OPAL SSC 1.00 (backward compatibility) Not supported –

OPAL SSC Additional Feature Set Specification

Additional DataStore Table Supported Specification 1.00 Revision 1.00, Feb 24, 2012

Single User Mode Supported Specification 1.00 Revision 1.00, Feb 24, 2012

TCG Storage Protection Mechanisms for

Secrets

Supported Specification Version 1.00 Revision 1.07 17 August,

2011

PSID – Physical Presence SID Supported Specification Version 1.00 Committee Draft Revi-

sion 1.05 February 9, 2011

GUDID (Globally Unique Serial Number) Supported Mandatory GUDID Proposal 11/03/2011 (Microsoft)

SID Authority Disable Supported SID Authority Disable Proposal 9/26/2011 (Micro-

soft)

Modifiable CommonName Columns Supported Modifiable CommonName Columns Proposal

7/22/2010 (Microsoft)

OPAL SSC Feature Set – Specific List

ALL OPAL Mandatory Features Supported –

Close Session (optional) Supported Allows Tper to notify the host it has aborted a ses-

sion

Restricted Command & Table (optional) Not Supported The interface control template enables TPer control

over selected interface commands; the benefit is

the reduction of undesired side effects

Type Table (not required) Not Supported –

Activate Method Supported –

Revert Method Supported –

Revert SP Method Supported –

Activate Method Within Transactions Not Supported As per OPAL, this behavior is out of the scope

Revert Method within Transactions Not Supported As per OPAL, this behavior is out of the scope

Revert SP Method within Transactions Not Supported As per OPAL, this behavior is out of the scope

Creation/Deletion of Tables/Rows after

Manufacturing

Not Supported As per OPAL, this behavior is out of the scope

Tper Feature

COM ID Management Support Not Supported Dynamic COM ID allocation & management not

supported

Buffer Management Support Not Supported Flow control

M500IT 2.5-Inch NAND Flash SLC SSD

TCG/Opal Support

CCMTD-731836775-10445

m500it_2_5_SLC_industrial_ssd.pdf - Rev. B 5/17 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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MTFDDAK032SBD-1AH12ITYY

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