IDT 89HPES32NT24AG2 Datasheet
2 of 38 December 17, 2013
– High performance switch core architecture
• Combined Input Output Queued (CIOQ) switch architecture
with large buffers
Clocking
– Supports 100 MHz and 125 MHz reference clock frequencies
– Flexible port clocking modes
• Common clock
• Non-common clock
• Local port clock with SSC (spread spectrum setting) and port
reference clock input
Hot-Plug and Hot Swap
– Hot-plug controller on all ports
• Hot-plug supported on all downstream switch ports
– All ports support hot-plug using low-cost external I
2
C I/O
expanders
– Configurable presence-detect supports card and cable appli-
cations
– GPE output pin for hot-plug event notification
• Enables SCI/SMI generation for legacy operating system
support
– Hot-swap capable I/O
Power Management
– Supports D0, D3hot and D3 power management states
– Active State Power Management (ASPM)
• Supports L0, L0s, L1, L2/L3 Ready, and L3 link states
• Configurable L0s and L1 entry timers allow performance/
power-savings tuning
– SerDes power savings
• Supports low swing / half-swing SerDes operation
• SerDes associated with unused ports are turned off
• SerDes associated with unused lanes are placed in a low
power state
Reliability, Availability, and Serviceability (RAS)
– ECRC support
– AER on all ports
– SECDED ECC protection on all internal RAMs
– End-to-end data path parity protection
– Checksum Serial EEPROM content protected
– Ability to generate an interrupt (INTx or MSI) on link up/down
transitions
Initialization / Configuration
– Supports Root (BIOS, OS, or driver), Serial EEPROM, or
SMBus switch initialization
– Common switch configurations are supported with pin strap-
ping (no external components)
– Supports in-system Serial EEPROM initialization/program-
ming
On-Die Temperature Sensor
– Range of 0 to 127.5 degrees Celsius
– Three programmable temperature thresholds with over and
under temperature threshold alarms
– Automatic recording of maximum high or minimum low
temperature
9 General Purpose I/O
Test and Debug
– Ability to inject AER errors simplifies in system error handling
software validation
– On-chip link activity and status outputs available for several
ports
– Per port link activity and status outputs available using
external I
2
C I/O expander for all remaining ports
– Supports IEEE 1149.6 AC JTAG and IEEE 1149.1 JTAG
Standards and Compatibility
– PCI Express Base Specification 2.1 compliant
– Implements the following optional PCI Express features
• Advanced Error Reporting (AER) on all ports
• End-to-End CRC (ECRC)
• Access Control Services (ACS)
• Device Serial Number Enhanced Capability
• Sub-System ID and Sub-System Vendor ID Capability
• Internal Error Reporting
• Multicast
• VGA and ISA enable
• L0s and L1 ASPM
• ARI
Power Supplies
– Requires three power supply voltages (1.0V, 2.5V, and 3.3V)
Packaged in a 23mm x 23mm 484-ball Flip Chip BGA with
1mm ball spacing
Product Description
With Non-Transparent Bridging functionality and innovative Switch
Partitioning feature, the PES32NT24AG2 allows true multi-host or multi-
processor communications in a single device. Integrated DMA control-
lers enable high-performance system design by off-loading data transfer
operations across memories from the processors. Each lane is capable
of 5 GT/s link speed in both directions and is fully compliant with PCI
Express Base Specification 2.1.
A non-transparent bridge (NTB) is required when two PCI Express
domains need to communicate to each other. The main function of the
NTB block is to initialize and translate addresses and device IDs to
allow data exchange across PCI Express domains. The major function-
alities of the NTB block are summarized in Table 1.