MAX1937/MAX1938/MAX1939
Two-Phase Desktop CPU Core Supply
Controllers with Controlled VID Change
16 ______________________________________________________________________________________
MOSFET Drivers
The DH_ and DL_ drivers are optimized for driving large
high-side (N1 and N2) and larger low-side MOSFETs
(N3 and N4). This is consistent with the low duty-cycle
operation of the controller. The DL_ low-side drive wave-
form is always the complement of the DH_ high-side
drive waveform, with a fixed dead-time between one
MOSFET turning off and the other turning on to prevent
cross-conduction or shoot-through current.
The internal transistor that drives DL_ low is robust with
a 0.5Ω (typ) on-resistance. This helps prevent DL_ from
being pulled up during the fast rise time of the LX_
node due to capacitive coupling from the drain to the
gate of the low-side synchronous-rectifier MOSFET.
However, some combinations of high-side and low-side
MOSFETs may cause excessive gate-drain coupling,
leading to poor efficiency, EMI, and shoot-through cur-
rents. This is often remedied by adding a resistor (typi-
cally less than 5Ω) in series with BST_, which increases
the turn-on time of the high-side MOSFET without
degrading the turn-off time.
Current-Limit Circuit
The MAX1937/MAX1938/MAX1939 use either the on-
resistance of the low-side MOSFETs or a current-sense
resistor to monitor the inductor current. Using the low-
side MOSFETs’ on-resistance as the current-sense ele-
ment provides a lossless and inexpensive solution ideal
for high-efficiency or cost-sensitive applications. The dis-
advantage to this method is that the on-resistance of
MOSFETs vary from part to part, and overtemperature,
which means it cannot be counted on for high accuracy.
If high accuracy is needed, use current-sense resistors,
which provide an accurate current limit under all condi-
tions but reduce efficiency slightly because of the power
lost in the resistors.
The current-limit circuit employs a “valley” current-
sensing algorithm to monitor the inductor current. If the
current-sense signal does not drop below the current-
limit threshold, the controller does not initiate a new
cycle. This limits the maximum value of I
VALLEY
to the
current set by the current-limit threshold (Figure 2).
The current-limit threshold is adjustable over a wide
range, allowing for a range of current-sense resistor
values. The voltage on ILIM sets the current-limit
threshold between PGND and CS_ to 0.1
V
ILIM
. The
10mV to 200mV adjustment range corresponds to ILIM
voltages from 100mV to 2V. The ILIM voltage is set by a
resistor-divider between REF and GND. See the Setting
the Current Limit section for details.
Current Balancing
The DC current balancing between phases depends on
the accuracy of the current-sense elements and the off-
set of the current-balance amplifier.
The maximum offset of the current-balance amplifier
(V
CBOFFSET
) is ±3mV. The current-balance accuracy
can be calculated from:
Current-balance accuracy = V
CBOFFSET
/ (I
L
R
CS
)
where I
L
is the peak inductor current and R
CS
is the
value of the current-sense resistor.
The current-balance accuracy is most important at full
load. With a load current of 50A (I
L
= 25A) and 2mΩ
current-sense resistors, the worst-case current-balance
accuracy is:
Current-balance accuracy = 0.003 / (25
0.002) = 6%
If the on-resistance of the low-side MOSFETs is used
for current sensing, the part-to-part variation of the
MOSFET on-resistance is a significant factor in the cur-
rent balance. The matching between MOSFETs should
be on the order of 15%, worst case. Thus, even if the
current-balance amplifier has no offset, the DC-current
balance could be as bad as 15%. In practice, a little
help is received from the thermal ballasting of the
MOSFETs. That is to say, the positive temperature coef-
ficient of the on-resistance of MOSFETs reduces the
mismatch current between the two phases.
Voltage Positioning (VPOS)
During a load transient, the output voltage instantly
changes by the ESR of the output capacitors times the
change in load current (ΔV
OUT
= -ESR
COUT
ΔI
LOAD
).
Conventional DC-DC converters respond by regulating
the output voltage back to its nominal state after the
load transient occurs (Figure 3). However, the CPU
requires that the output voltage remain within a specific
voltage band. Dynamically positioning the output volt-
age allows the use of fewer output capacitors and
reduces power consumption under heavy load.
For a conventional (nonvoltage-positioned) circuit, the
total output voltage deviation from light load to full load
and back to light load is:
V
P-P1
= 2
(ESR
COUT
ΔI
LOAD
) + V
SAG
+ V
SOAR
where V
SAG
and V
SOAR
are defined in the Output
Capacitor Selection section. Setting the converter to
regulate at a lower voltage when under load allows a
larger voltage step when the output current suddenly
decreases. The total voltage change for a voltage-posi-
tioned circuit is:
V
P-P2
= (ESR
COUT
ΔI
LOAD
) + V
SAG
+V
SOAR
MAX1937/MAX1938/MAX1939
Two-Phase Desktop CPU Core Supply
Controllers with Controlled VID Change
______________________________________________________________________________________ 17
The maximum allowable voltage change during a tran-
sient is fixed by the supply range of the CPU (V
P-P1
=
V
P-P2
). This means that the voltage-positioned circuit
tolerates twice the ESR in the output capacitors.
Because the ESR specification is achieved by parallel-
ing several capacitors, fewer capacitors are needed for
the voltage-positioned circuit. Figure 4 shows transient
response regions.
An additional benefit of voltage positioning is reduced
power consumption at high-load currents. Because the
output voltage is lower under heavy load, the CPU
draws less current. The result is lower power dissipa-
tion in the CPU.
Voltage Reference (REF)
A 2V reference is provided on the MAX1937/MAX1938/
MAX1939 through the REF pin. REF is capable of
sourcing or sinking up to 50µA. In addition to providing
a reference for the IC, REF is used for setting the cur-
rent limit and voltage positioning. Connect a 0.47µF
capacitor from REF to GND. This capacitor should be
placed as close as possible to the REF pin.
A UVLO is provided for the reference voltage. The ref-
erence voltage must rise above 1.600V to activate the
controller. The controller is disabled if the reference
voltage falls below 1.584V.
Enable Input (EN) and Soft-Start
When EN is low, DL_ and DH_ are held low (turning off
the MOSFETs), leaving LX_ high impedance. In addi-
tion, the reference is turned off and PWRGD is pulled
low. In shutdown, total current consumption is about
50µA (typ).
In the case of shutdown by VID code, only DL_ and
DH_ are held low. The rest of the controller is enabled.
When EN is driven high, the startup sequence begins.
Once the reference voltage rises above its 1.6V UVLO
threshold, the controller begins switching and starts to
ramp up the output voltage. The output voltage is
ramped up in 25mV steps every 50µs until the output
reaches the nominal output voltage.
Fault Conditions
The MAX1937/MAX1938/MAX1939 contain internal cir-
cuitry to protect themselves and surrounding circuitry
from damage from output overvoltage and output
undervoltage conditions. When either of these condi-
tions occurs, DH_ is pulled low, DL_ is driven high, and
PWRGD is pulled low. These pins remain in this state
until either power is cycled on V
DD
or EN is toggled
high-low-high.
Setting the Output Voltage (VID_)
An internal DAC is used to set the output regulation
voltage. A 5-bit code on inputs VID0–VID4 is used to
specify the output voltage. Some codes disable the
output. There is an internal 100kΩ pullup resistor to
VDD on each of the VID_ inputs. Connecting VID_ to
GND sets the bit to logic low (0); connecting VID_ to
VDD or leaving it unconnected sets the bit to logic high
(1). Use external pullup resistors to speed the low-to-
high logic transition, or for lower logic voltages. See
Table 1 for a list of codes and corresponding output
regulation voltages for each of the parts.
The VID_ codes for the MAX1937 comply with AMD
Hammer code. The VID_ codes on the MAX1938 are
INDUCTOR CURRENT
TIME
I
PEAK
I
LOAD
I
VALLEY
Figure 2. Inductor Current Waveform
B
1.4V
1.4V
A
A. CONVENTIONAL CONVERTER (50mV/div)
B. VOLTAGE-POSITIONED OUTPUT (50mV/div)
VOLTAGE POSITIONING THE OUTPUT
Figure 3. Voltage-Positioning and Nonvoltage-Positioning
Waveforms
MAX1937/MAX1938/MAX1939
Two-Phase Desktop CPU Core Supply
Controllers with Controlled VID Change
18 ______________________________________________________________________________________
set for Intel VRM 9.0/9.1 and AMD Athlon. The
MAX1939 is set for AMD Athlon Mobile.
VID_ Change Slew Rate (TIME)
The MAX1937/MAX1938/MAX1939 allow the VID_ code
to be changed while the converter is operating (on-the-
fly). The slew rate at which the output voltage is chang-
ing is controlled through TIME. The slew rate is
adjusted externally by connecting a 47kΩ to 470kΩ
resistor (R
TIME
) from TIME to GND. To set the slew rate,
select the R
TIME
resistor using the following equation:
where SR is the slew rate of the output voltage in V/µs.
The output voltage is stepped up or down in 25mV
steps until it reaches the voltage set by the new VID
code.
Power-Good Output (PWRGD)
PWRGD is an open-drain output that is pulled low when
the output voltage deviates more than 12.5% from its
regulation voltage (set by VID_ inputs). PWRGD is
pulled low in shutdown, input UVLO, and during start-
up. Any fault condition forces PWRGD low until the fault
is cleared, and the IC is reset by cycling power at V
DD
or momentarily toggling EN. For logic-level output volt-
ages, connect an external pullup resistor between
PWRGD and the logic power supply. A 100kΩ resistor
works well in most applications.
Design Procedure
Output Inductor Selection
For most applications, an inductor value of 0.5µH to
1µH is recommended. The inductance is set by the
desired amount of inductor current ripple (LIR). A larger
inductance value minimizes output ripple current and
increases efficiency, but slows transient response. For
the best compromise of size, cost, and efficiency, a LIR
of 30% to 40% is recommended (LIR = 0.3 to 0.4). The
inductor value is found from:
where f
sw
is the actual switching frequency of a phase.
The selected inductor should have the lowest possible
equivalent DC resistance and a saturation current
greater than the peak inductor current (I
PEAK
). I
PEAK
is
found from:
Output Capacitor Selection
The output capacitor must have low enough ESR to
meet output ripple and load-transient requirements.
Also, the capacitance value must be high enough to
absorb the inductor energy going from a full-load to a
no-load condition without tripping the OVP circuit.
In CPU core power supplies and other applications
where the output is subject to large load transients, the
output capacitor’s size typically depends on how much
ESR is needed to prevent the output from dipping too
low under a load transient. Ignoring the sag due to
finite capacitance:
R
ESR
= V
STEP(MAX)
/ ΔI
LOAD(MAX)
The actual capacitance value required relates to the
physical size needed to achieve low ESR, as well as to
the chemistry of the capacitor technology. Thus, the
capacitor is usually selected by ESR and voltage rating
rather than by capacitance value (this is true of OS-
CONs, SP capacitors, POSCAPs, and other electrolytic
capacitors). Generally, ceramic capacitors are not rec-
ommended for bulk output capacitance but make
excellent high-frequency decoupling capacitors.
Once enough capacitance is added to meet the over-
shoot requirement, undershoot at the rising load edge
II
LIR
PEAK LOAD MAX
+
()
1
2
L
VVV
V f I LIR
OUT IN OUT
IN SW LOAD MAX
=
×−
()
×× ×
()
R
SR
TIME
=
521
()Ω
V
OUT
ESR VOLTAGE STEP
(I
STEP
x R
ESR
)
CAPACITIVE SOAR
(dV/dt = I
OUT
/C
OUT
)
RECOVERY
CAPACITIVE SAG
(dV/dt = I
OUT
/C
OUT
)
I
LOAD
Figure 4. Transient Response Regions

MAX1937EEI+

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Switching Controllers 2-Phase Desktop CPU Core Supply Ctlr
Lifecycle:
New from this manufacturer.
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