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LW T673-P1S1-5K8L-Z

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16
2007-12-14 10
LW T673
Maßzeichnung
8)
Seite 16
Package Outlines
8) page 16
Kathodenkennung: abgeschrägte Ecke
Cathode mark: bevelled edge
Gewicht / Approx. weight: 35 mg
Gurtung / Polarität und Lage
8)
Seite 16
Verpackungseinheit 2000/Rolle, ø180 mm
oder 8000/Rolle, ø330 mm
Method of Taping / Polarity and Orientation
8) page 16
Packing unit 2000/reel, ø180 mm
or 8000/reel, ø330 mm
GPLY6724
0.7 (0.028)
0.9 (0.035)
1.7 (0.067)
2.1 (0.083)
0.12 (0.005)
0.18 (0.007)
0.5 (0.020)
1.1 (0.043)
3.3 (0.130)
3.7 (0.146)
0.4 (0.016)
0.6 (0.024)
2.6 (0.102)
3.0 (0.118)
2.1 (0.083)
2.3 (0.091)
Cathode marking
3.0 (0.118)
3.4 (0.134)
(2.4) (0.095)
0.1 (0.004) (typ.)
4˚±1
A
C
OHAY2271
3.6 (0.142)
8 (0.315)
3.5 (0.138)
1.75 (0.069)
4 (0.157)1.5 (0.059)
2.9 (0.114)
4 (0.157)
2 (0.079) Cathode/Collector Marking
LW T673
2007-12-14 11
Empfohlenes Lötpaddesign
8) 9)
Seite 16
IR Reflow Löten
Recommended Solder Pad
8) 9) page 16
IR Reflow Soldering
Empfohlenes Lötpaddesign verwendbar für TOPLED
®
und Power TOPLED
®
IR Reflow Löten
8)
Seite 16
Recommended Solder Pad useable for TOPLED
®
and Power TOPLED
®
IR Reflow Soldering
8) page 16
OHLPY970
4.5 (0.177)
2.6 (0.102)
1.5 (0.059)
Cu-area > 16 mm
Cu-Fläche > 16 mm
2
2
Solder resist
Lötstopplack
4.5 (0.177)
1.5 (0.059)
2.6 (0.102)
Padgeometrie für
improved heat dissipation
verbesserte Wärmeableitung
Paddesign for
OHLPY440
Padgeometrie für
verbesserte Wärmeableitung
improved heat dissipation
Paddesign for
Lötstoplack
Solder resist
0.8 (0.031)
3.7 (0.146)
1.1 (0.043)
2.3 (0.091)
3.3 (0.130)
1.5 (0.059)
11.1 (0.437)
Cu Fläche / 16 mm per pad
2
Cu-area
_
<
3.3 (0.130)
Kathode/
Cathode
Anode
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
0.7 (0.028)
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
2007-12-14 12
LW T673
Lötbedingungen Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
IR-Reflow Lötprofil für bleifreies Löten (nach J-STD-020B)
IR Reflow Soldering Profile for lead free soldering (acc. to J-STD-020B)
Wellenlöten (TTW) (nach CECC 00802)
TTW Soldering (acc. to CECC 00802)
OHLA0687
0
0
T
t
˚C
s
120 s max
50
100
150
200
250
300
Ramp Up
100 s max
50 100 150 200 250 300
Ramp Down
6 K/s (max)
3 K/s (max)
25 ˚C
30 s max
260 ˚C
+0 ˚C
-5 ˚C
245 ˚C
±5 ˚C
240 ˚C
255 ˚C
217 ˚C
Maximum Solder Profile
Recommended Solder Profile
235 ˚C
-0 ˚C
+5 ˚C
Minimum Solder Profile
10 s min
OHLY0598
0
0
50 100 150 200 250
50
100
150
200
250
300
T
t
C
s
235 C
10 s
C... 260
1. Welle
1. wave
2. Welle
2. wave
5 K/s
2 K/s
ca 200 K/s
CC... 130100
2 K/s
Zwangskühlung
forced cooling
Normalkurve
standard curve
Grenzkurven
limit curves
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16

LW T673-P1S1-5K8L-Z

Mfr. #:
Buy LW T673-P1S1-5K8L-Z
Manufacturer:
OSRAM Opto Semiconductors
Description:
Standard LEDs - SMD White, 5600K 224mcd, 10mA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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