13
LT3028
3028f
Voltage and temperature coefficients are not the only
sources of problems. Some ceramic capacitors have a
piezoelectric response. A piezoelectric device generates
voltage across its terminals due to mechanical stress,
similar to the way a piezoelectric accelerometer or
microphone works. For a ceramic capacitor the stress
can be induced by vibrations in the system or thermal
transients. The resulting voltages produced can cause
appreciable amounts of noise, especially when a ceramic
capacitor is used for noise bypassing. A ceramic capaci-
tor produced Figure 6’s trace in response to light tapping
from a pencil. Similar vibration induced behavior can
masquerade as increased output voltage noise.
APPLICATIO S I FOR ATIO
WUUU
For continuous normal conditions, the maximum junction
temperature rating of 125°C must not be exceeded. It is
important to give careful consideration to all sources of
thermal resistance from junction to ambient. Additional
heat sources mounted nearby must also be considered.
For surface mount devices, heat sinking is accomplished
by using the heat spreading capabilities of the PC board
and its copper traces. Copper board stiffeners and plated
through-holes can also be used to spread the heat gener-
ated by power devices.
The following tables list thermal resistance for several
different board sizes and copper areas. All measurements
were taken in still air on 3/32" FR-4 board with one ounce
copper.
Table 1. FE Package, 16-Lead TSSOP
COPPER AREA THERMAL RESISTANCE
TOPSIDE* BACKSIDE BOARD AREA (JUNCTION-TO-AMBIENT)
2500mm
2
2500mm
2
2500mm
2
38°C/W
1000mm
2
2500mm
2
2500mm
2
43°C/W
225mm
2
2500mm
2
2500mm
2
48°C/W
100mm
2
2500mm
2
2500mm
2
60°C/W
*Device is mounted on topside.
Table 2. DHC Package, 16-Lead DFN
COPPER AREA THERMAL RESISTANCE
TOPSIDE* BACKSIDE BOARD AREA (JUNCTION-TO-AMBIENT)
2500mm
2
2500mm
2
2500mm
2
40°C/W
1000mm
2
2500mm
2
2500mm
2
45°C/W
225mm
2
2500mm
2
2500mm
2
50°C/W
100mm
2
2500mm
2
2500mm
2
62°C/W
*Device is mounted on topside.
The thermal resistance junction-to-case (θ
JC
), measured
at the Exposed Pad on the back of the die is 10°C/W for the
DFN package and 8°C/W for the TSSOP package.
Calculating Junction Temperature
Example: Given Output 1 set for an output voltage of 3.3V,
Output 2 set for an output voltage of 2.5V, an input voltage
range of 3.8V to 5V, an output current range of 0mA to
500mA for Output 1, an output current range of 0mA to
100mA for Output 2 and a maximum ambient temperature
of 50°C, what will the maximum junction temperature be?
100ms/DIV 3028 F05
V
OUT
500µV/DIV
Figure 6. Noise Resulting from Tapping on a Ceramic Capacitor
C
OUT
= 10µF
C
BYP
= 0.01µF
I
LOAD
= 100mA
Thermal Considerations
The power handling capability of the device will be limited
by the maximum rated junction temperature (125°C). The
power dissipated by the device will be made up of two
components for each output:
1. Output current multiplied by the input/output voltage
differential: (I
OUT
)(V
IN
– V
OUT
), and
2. GND pin current multiplied by the input voltage:
(I
GND
)(V
IN
).
The ground pin current can be found by examining the
GND Pin Current curves in the Typical Performance Char-
acteristics section. Power dissipation will be equal to the
sum of the two components listed above.
The LT3028 regulator has internal thermal limiting de-
signed to protect the device during overload conditions.
14
LT3028
3028f
The power dissipated by each output will be equal to:
I
OUT(MAX)
(V
IN(MAX)
– V
OUT
) + I
GND
(V
IN(MAX)
)
Where for Output 1:
I
OUT(MAX)
= 500mA
V
IN(MAX)
= 5V
I
GND
at (I
OUT
= 500mA, V
IN
= 5V) = 9mA
For Output 2:
I
OUT(MAX)
= 100mA
V
IN(MAX)
= 5V
I
GND
at (I
OUT
= 100mA, V
IN
= 5V) = 2mA
So for Output 1:
P = 500mA (5V – 3.3V) + 9mA (5V) = 0.90W
For Output 2:
P = 100mA (5V – 2.5V) + 2mA (5V) = 0.26W
The thermal resistance will be in the range of 35°C/W to
55°C/W depending on the copper area. So the junction
temperature rise above ambient will be approximately
equal to:
(0.90W + 0.26W) 50°C/W = 57.8°C
The maximum junction temperature will then be equal to
the maximum junction temperature rise above ambient
plus the maximum ambient temperature or:
T
JMAX
= 50°C + 57.8°C = 107.8°C
Protection Features
The LT3028 regulator incorporates several protection
features which make it ideal for use in battery-powered
circuits. In addition to the normal protection features
associated with monolithic regulators, such as current
limiting and thermal limiting, the device is protected
against reverse input voltages and reverse voltages from
output to input. The two regulators have common inputs
and GND pins and are thermally coupled, however, the two
outputs of the LT3028 operate independently. They can be
shut down independently and a fault condition on one
output will not affect the other output electrically.
APPLICATIONS INFORMATION
WUU
U
Current limit protection and thermal overload protection
are intended to protect the device against current overload
conditions at the output of the device. For normal opera-
tion, the junction temperature should not exceed 125°C.
The input of the device will withstand reverse voltages of
20V. Current flow into the device will be limited to less than
1mA (typically less than 100µA) and no negative voltage
will appear at the output. The device will protect both itself
and the load. This provides protection against batteries
which can be plugged in backward.
The output of the LT3028 can be pulled below ground
without damaging the device. If the input is left open circuit
or grounded, the output can be pulled below ground by
20V. The output will act like an open circuit; no current will
flow out of the pin. If the input is powered by a voltage
source, the output will source the short-circuit current of
the device and will protect itself by thermal limiting. In this
case, grounding the SHDN1/SHDN2 pins will turn off the
device and stop the output from sourcing the short-circuit
current.
The ADJ pins can be pulled above or below ground by as
much as 7V without damaging the device. If the input is left
open circuit or grounded, the ADJ pins will act like an open
circuit when pulled below ground and like a large resistor
(typically 100k) in series with a diode when pulled above
ground.
In situations where the ADJ pins are connected to a
resistor divider that would pull the pins above their 7V
clamp voltage if the output is pulled high, the ADJ pin input
current must be limited to less than 5mA. For example, a
resistor divider is used to provide a regulated 1.5V output
from the 1.22V reference when the output is forced to 20V.
The top resistor of the resistor divider must be chosen to
limit the current into the ADJ pin to less than 5mA when the
ADJ pin is at 7V. The 13V difference between output and
ADJ pin divided by the 5mA maximum current into the ADJ
pin yields a minimum top resistor value of 2.6k.
15
LT3028
3028f
U
PACKAGE DESCRIPTIO
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation BB
In circuits where a backup battery is required, several
different input/output conditions can occur. The output
voltage may be held up while the input is either pulled to
ground, pulled to some intermediate voltage or is left open
circuit.
When the IN pin of the LT3028 is forced below either OUT
pin or either OUT pin is pulled above the IN pin, input current
APPLICATIONS INFORMATION
WUU
U
FE16 (BB) TSSOP 0204
0.09 – 0.20
(.0035 – .0079)
0° – 8°
0.25
REF
0.50 – 0.75
(.020 – .030)
4.30 – 4.50*
(.169 – .177)
134
5
6
7
8
10 9
4.90 – 5.10*
(.193 – .201)
16 1514 13 12 11
1.10
(.0433)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
2.94
(.116)
0.195 – 0.30
(.0077 – .0118)
TYP
2
RECOMMENDED SOLDER PAD LAYOUT
0.45 ±0.05
0.65 BSC
4.50 ±0.10
6.60 ±0.10
1.05 ±0.10
2.94
(.116)
3.58
(.141)
3.58
(.141)
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
6.40
(.252)
BSC
for the corresponding regulator will typically drop to less
than 2µA. This can happen if the input of the device is
connected to a discharged (low voltage) battery and the out-
put is held up by either a backup battery or a second regu-
lator circuit. The state of the SHDN1/SHDN2 pin will have
no effect on the reverse output current when the output is
pulled above the input.

LT3028EDHC#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
LDO Voltage Regulators 2x 100mA/500mA L Drop, L N, uP Regs w/ I
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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