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CPC1106N

P1-P3P4-P6
I
NTEGRATED
C
IRCUITS
D
IVISION
www.ixysic.com
4
R04
CPC1106N
*The Performance Data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (:)
3.0
3.5
4.0
4.5
5.0
Typical On-Resistance
vs. Temperature
(I
F
=0mA, I
L
=50mA)
Load Voltage (V)
-0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4
Load Current (mA)
-100
-50
0
50
100
Typical Load Current
vs. Load Voltage
(I
F
=0mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mA)
40
45
50
55
60
65
70
75
80
Maximum Load Current
vs. Temperature
(I
F
=0mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (V
P
)
72
74
76
78
80
82
84
Typical Blocking Voltage
vs. Temperature
(I
F
=1mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage Current (nA)
0
10
20
30
40
50
Typical Leakage vs. Temperature
Measured Across Pins 3&4
(I
F
=1mA, V
L
=60V)
Load Voltage (V)
0 102030405060
Output Capacitance (pF)
5
10
15
20
25
30
35
40
Output Capacitance vs. Load Voltage
(I
F
=0.5mA)
Time
10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s
Load Current (mA)
0
100
200
300
400
500
600
700
800
Energy Rating Curve
(I
F
=0mA)
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted)*
I
NTEGRATED
C
IRCUITS
D
IVISION
CPC1106N
www.ixysic.com
5
R04
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
CPC1106N MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time Maximum Refl ow Cycles
CPC1106N 260ºC for 30 seconds 3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
I
NTEGRATED
C
IRCUITS
D
IVISION
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1106N-R04
©Copyright 2014, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
11/10/2014
For additional information please visit our website at: www.ixysic.com
6
CPC1106N
Mechanical Dimensions
Recommended PCB Land Pattern
2.54
(0.10)
5.60
(0.2205)
1.30
(0.0512)
0.60
(0.0217)
Dimensions
mm
(inches)
Pin 1
4.089 ± 0.203
(0.161 ± 0.008)
2.54 Typ
(0.100 Typ)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.076
(0.150 ± 0.003)
0.432 ± 0.127
(0.017 ± 0.005)
0.200 ± 0.025
(0.008 ± 0.001)
1.02 ± 0.025
(0.040 ± 0.001)
2.184 Max
(0.086 Max)
0.381 TYP.
(0.015 TYP.)
Pin to package standoff:
0.0637 ± 0.0383
(0.0025 ± 0.0015)
0.762 ± 0.102
(0.030 ± 0.004)
Dimensions
mm
(inches)
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
U
ser Direction o
f
Feed
User Direction of Feed
K
0
=2.70
(0.106)
K
1
=2.30
(0.091)
B
0
=4.70
(0.185)
W=12.00
(0.472)
P=8.00
(0.315)
A
0
=6.50
(0.256)
CPC1106N
CPC1106NTR Tape & Reel
P1-P3P4-P6

CPC1106N

Mfr. #:
Buy CPC1106N
Manufacturer:
IXYS Integrated Circuits
Description:
Solid State Relays - PCB Mount 1-Form-B, 60V, 75mA 4-Pin SOP
Lifecycle:
New from this manufacturer.
Delivery:
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