ADP3623/ADP3624/ADP3625/ADP3633/ADP3634/ADP3635
Rev. A | Page 6 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
VDD −0.3 V to +20 V
OUTA, OUTB
DC −0.3 V to V
DD
+ 0.3 V
<200 ns −2 V to V
DD
+ 0.3 V
INA,
INA
, INB, −0.3 V to V
DD
+ 0.3 V
INB
, and SD
ESD
Human Body Model (HBM) 3.5 kV
Field Induced Charged Device Model
(FICDM)
SOIC_N_EP 1.5 kV
MINI_SO_EP 1.0 kV
θ
, JEDEC 4-Layer Board
SOIC_N_EP
1
59°C/W
MINI_SO_EP
1
43°C/W
Junction Temperature Range −40°C to +150°C
Storage Temperature Range −65°C to +150°C
Lead Temperature
Soldering (10 sec) 300°C
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 260°C
1
θ
JA
is measured per JEDEC standards, JESD51-2, JESD51-5, and JESD51-7, as
appropriate with the exposed pad soldered to the PCB.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
